Grinding pad, grinding device and method for manufacturing grinding pad

Abstract

The invention relates to a grinding pad which comprises a foam resin structural framework and a plurality of auxiliary fibers. The auxiliary fibers are independent to one another and optionally dispersed in the foam resin structural framework. The invention further provides a grinding device and a method for manufacturing the grinding pad.

Description

technical field [0001] The invention relates to a grinding (polishing) pad, a grinding device and a method for manufacturing the grinding pad. Background technique [0002] Grinding generally refers to the abrasion control of initially rough surfaces in the chemical mechanical polishing (CMP) process, which uses a fine particle-containing abrasive slurry to evenly disperse on the upper surface of a polishing pad, and simultaneously puts a substrate to be polished against Hold the pad and rub in repeated regular motions. The substrate to be polished is such as semiconductor, storage medium substrate, integrated circuit, flat glass of liquid crystal display, optical glass and photoelectric panel. During the grinding process, a grinding pad must be used to grind the substrate to be polished, so the quality of the grinding pad will directly affect the grinding effect of the substrate to be polished. [0003] refer to figure 1 , which shows a schematic diagram of a grinding ap...

AI Technical Summary

Problems solved by technology

However, the biggest problem with the grinding pad 35 is that the concentration of the resin 352 is not uniformly distributed in the circular mold cylinder, and the difference in temperature distribution at each position of the circular mold cylinder during molding will cause the size and distribution of the holes 353 different, and difficult to control, and then through the slicing process, the size of the holes 353 on the slicing surface of the grinding pad 35 will be more obvious

In addition, the holes 353 are not communicated with each other, which makes it difficult for the polishing liquid to circulate during use, and the polishing slurry cannot penetrate into the inside of the polishing pad during grinding, so that the effect of keeping the polishing liquid on the surface is low. On the other hand, due to its high hardness , low thermal compression rate, easy to cause scratches on the substrate to be ground, usually only suitable for rough polishing

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