A kind of heat-resistant self-adhesive enameled wire varnish and preparation method thereof
A self-adhesive enameled wire varnish, heat-resistant technology, applied in coatings, epoxy resin coatings, etc., can solve problems such as difficulty in overcoming enameled wire wet sticking defects, failure to meet production needs, easy cracking and aging of the paint film, and improve adhesion Strength and molding mechanical strength, beneficial to stability, and the effect of improving alignment
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0030] Add 350 parts of xylene and 430 parts of N-methylpyrrolidone (water content ≤ 0.05%) into a reaction kettle with a stirrer, stir and mix evenly, turn on and heat to 50°C, adopt a step-by-step feeding method, and put 169 parts in 15 minutes Parts of polyetherimide resin (heat distortion temperature is 208°C under the condition of 1.82Mpa) particles, and at the same time, stir and gradually increase the temperature to 110°C, keep it for 2h, until it is completely dissolved, and obtain mixture A; cool mixture A to 60°C , put in 17.2 parts of FB resin, keep warm for 1.5h, until the resin is uniform, then cool down to 45°C, add 33.8 parts of preheated phenol-formaldehyde epoxy resin, keep warm for 1h, until the mixture is evenly stirred to obtain mixture B; Put 0.2 parts of BYK-310 slip agent into the mixture, stir evenly and then filter, the obtained filtrate is heat-resistant self-adhesive wire enamel.
[0031] The heat-resistant self-adhesive wire enamel prepared in this ...
Embodiment 2
[0033] Add 270 parts of xylene and 510 parts of N-methylpyrrolidone (water content ≤ 0.05%) into a reactor with a stirrer, stir and mix evenly, turn on and heat to 55°C, adopt a step-by-step feeding method, and put 176 Parts of polyetherimide resin (heat distortion temperature is 210°C under the condition of 1.82Mpa) particles, and while stirring, the temperature is gradually raised to 105°C, and the temperature is kept for 2.5h until it is completely dissolved to obtain the mixture A; the mixture A is cooled to 60 ℃, put in 17.6 parts of FB resin, keep it warm for 1.5h, until the resin is uniform, then cool down to 45°C, add 26.4 parts of preheated phenol-formaldehyde epoxy resin, keep it warm for 1.5h, until it is evenly stirred to obtain mixture B; Put 0.2 parts of BYK-310 slip agent into the mixture B, stir well and then filter, the obtained filtrate is heat-resistant self-adhesive wire enamel.
[0034] The heat-resistant self-adhesive wire enamel prepared in this example ...
Embodiment 3
[0036] Add 230 parts of xylene and 550 parts of N-methylpyrrolidone (water content ≤ 0.05%) into a reaction kettle with a stirrer, stir and mix evenly, turn on and heat to 60°C, adopt a step-by-step feeding method, and put 183 Parts of polyetherimide resin (heat distortion temperature is 208°C under the condition of 1.82Mpa) particles, and at the same time, stir and gradually increase the temperature to 110°C, keep it for 3h, until it is completely dissolved, and obtain mixture A; cool mixture A to 65°C , put in 18.3 parts of FB resin, keep it warm for 1 hour, until the resin is uniform, then cool down to 50°C, add 18.7 parts of preheated phenol-formaldehyde epoxy resin, keep it warm for 1 hour, until it is evenly stirred to obtain mixture B; Add 0.2 parts of BYK-310 slip agent, stir evenly and then filter, the obtained filtrate is heat-resistant self-adhesive wire enamel.
[0037] The heat-resistant self-adhesive wire enamel prepared in this example is a transparent homogeneo...
PUM
Property | Measurement | Unit |
---|---|---|
heat deflection temperature | aaaaa | aaaaa |
viscosity | aaaaa | aaaaa |
heat deflection temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com