LED package component, substrate and wafer level packaging method thereof

A technology of wafer-level packaging and LED packaging, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of wafer-level packaging that need to be studied, and achieve the effects of reducing packaging costs, simple operation process, and good heat dissipation performance

Inactive Publication Date: 2015-04-29
HKUST LED FPD TECH R&D CENT AT FOSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wafer-level packaging similar t

Method used

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  • LED package component, substrate and wafer level packaging method thereof
  • LED package component, substrate and wafer level packaging method thereof
  • LED package component, substrate and wafer level packaging method thereof

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0033] Embodiment 1 (LED package device embodiment)

[0034] See figure 1 , A schematic diagram of the structure of the LED package device provided by the present invention Figure . The LED package device provided by the present invention includes a substrate 1, an LED chip 2, a fluorescent layer 3, a base lens 4 and a secondary lens 5. Among them, the substrate 1 is assembled by the first substrate 11 and the second substrate 12. The first substrate 11 is provided with a penetrating recess 112 (or called a recess). The sidewall of the recess 112 has a certain slope and is inclined. The bottom opening of the recess 112 is smaller than the top opening of the recess. The longitudinal section of the hole 112 is trapezoidal. The size of the recessed hole 112 is determined according to the size of the LED chip 2. The larger the width of the recessed hole 112 is, the weaker the side of the light blocking effect and the higher the light extraction efficiency. However, the width of ...

Example Embodiment

[0040] Embodiment 2 (substrate embodiment)

[0041] See Image 6 ,this invention A substrate 1 for wafer-level packaging of LED chips is provided. The substrate 1 is assembled by the first substrate 11 and the second substrate 12.

[0042] The first substrate 11 is provided with a through hole 112 (or called a pit). The side wall 111 of the hole 112 has a certain slope and is inclined. The bottom opening of the hole 112 is smaller than the top opening of the hole 112 , The longitudinal section of the recessed hole 112 is trapezoidal. The size of the recessed hole 112 is determined according to the size of the LED chip. The larger the width of the recessed hole 112 is, the weaker the side of the light blocking effect, and the higher the light extraction efficiency. However, the width of the concave hole should also be controlled within a certain range to ensure that the substrate has a certain mechanical strength. Preferably, in the present invention, the width of the top openi...

Example Embodiment

[0046] Embodiment 3 (embodiment of wafer-level packaging method for LED package device)

[0047] The LED package device of Example 1 can be prepared by the following method, and the main steps are as follows:

[0048] 1) Production of the first substrate 11: see figure 2 ~3, prepare a silicon substrate 11, form a through recess 112 on the silicon substrate by chemical etching, and the sidewall 111 of the recess 112 is inclined, and the width of the bottom opening of the recess 112 is smaller than the width of the top opening of the recess 112; The depth of the recessed hole 112 is about 200 μm higher than the thickness of the LED chip (for example, 150-250 μm), so as to ensure a good subsequent phosphor coating. If the recessed hole 112 is too deep, the phosphor coating layer will increase in thickness, which is not conducive to light emission and heat dissipation; if the recessed hole is too shallow, the phosphor concentration required to achieve white light will increase, which ...

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Abstract

The invention provides a substrate used for LED chip wafer level packaging, a packaging method and an LED package component. The substrate comprises a first substrate and a second substrate, a cut-through concave hole is formed in the first substrate, the side wall of the concave hole is a slope, the width of an opening formed at the bottom of the concave hole is smaller than that of an opening formed at the top of the concave hole, and a light-reflecting layer overlaps the side wall of the concave hole; the top of the second substrate bonds with the bottom of the first substrate, at least two through holes are formed in the surface, corresponding to the concave hole position on the first substrate, of the second substrate, and the through holes are filled with metal; another light-reflecting layer overlaps the top surface of the second substrate, the light-reflecting layer of the second substrate and the light-reflecting layer portion corresponding to the concave hole position on the first substrate are separated into two light-reflecting layer areas, an eutectic bonding layer overlaps the surface of each light-reflecting layer area, and the eutectic bonding layer on the surface of each light-reflecting layer area corresponds to at least one through hole position on the second substrate. By means of the substrate, the coating technology of the fluorescent layer is greatly simplified.

Description

technical field [0001] The invention relates to the technical field of packaging of high-power white light LEDs, in particular to a wafer-level packaging method for LED packaging devices, a used substrate, and an LED packaging device obtained by packaging. Background technique [0002] As the fourth-generation electric light source, high-power LED has excellent characteristics such as small size, safety, low voltage, long life, high electro-optical conversion efficiency, fast response, energy saving, and environmental protection, so it is called "green lighting source". It is expected to replace traditional incandescent lamps and fluorescent lamps and become a new generation of light sources in the 21st century, which has great economic and social significance. With the vigorous advocacy of green energy saving, LED has gradually entered people's sight, and has developed rapidly in a short period of time. [0003] In the traditional LED packaging process that uses silicon wa...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/58
CPCH01L33/48H01L33/005H01L33/58H01L33/60
Inventor 李世玮田振寰
Owner HKUST LED FPD TECH R&D CENT AT FOSHAN
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