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Rare earth doped lead-free frit and electrical component sealing method utilizing the same

A technology for electrical components and glass frit, applied in the field of lead-free glass frit, can solve problems such as environmental hazards, and achieve the effects of easy processing and excellent sealing effect

Inactive Publication Date: 2015-05-20
谢再锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of these glass frits contain toxic elements such as antimony (Sb) and lead (Pb), which can cause environmental hazards

Method used

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  • Rare earth doped lead-free frit and electrical component sealing method utilizing the same
  • Rare earth doped lead-free frit and electrical component sealing method utilizing the same
  • Rare earth doped lead-free frit and electrical component sealing method utilizing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Example 1. [Manufacture of glass frit composition]

[0087] The glass frits of Examples 1-4 were produced with the material composition of the following Table 1, and the unit in Table 1 is mole %.

[0088] Table 1 (mol%)

[0089]

[0090]Heat the glass frit mixture in the above Table 1 to melt the composition, such as mixing in a high-temperature furnace (1650 ° C), and then pour cold water or liquid nitrogen on the melt to quench and fracture. -mill) repeated grinding and mixing, the required glass frit particle size 0.1-20um can be obtained, which meets the size of 325 mesh or 400 mesh screen. The glass frit of Examples 1-4 is characterized in that the softening temperature Tdsp is 300-400° C., which is suitable for low-temperature processing of the glass frit.

Embodiment 2

[0091] Example 2 [Manufacture of glass frit paste composition]

[0092] Frit paste compositions were made using the frit mixtures of Examples 1-4 above. Weigh 70 parts by weight of the glass frit mixture in the above-mentioned examples 1-4 with 30 parts by weight of EC ethyl cellulose / BCA butyl carbitol acetate, AC acrylic resin / 2,2,4-trimethyl Base-1.3 pentanediol monoisobutyrate (texanol alcohol ester), or polyalkylene carbonate (Polyalkylene Carbonate) / triglyme dimethyl ether to make the following four glass frit paste compositions (No. 1 -4). By adjusting different weight ratios of the polymer binder and the solvent, different viscosities of the glass frit paste composition can be obtained, so as to be suitable for the operation of the screen printing process.

[0093] Furthermore, the glass frit paste composition is further inverted on a three-roll machine for one or several times of mixing, which can achieve a more ideal silk screen printing effect.

[0094] Table 2. ...

Embodiment 3

[0108] Example 3 [Hermetic sealing of OLED element]

[0109] The present invention discloses that the glass frit is fixed on a predetermined position of the first glass substrate through a screen printing process or a dispensing coating process, and a radiation source is used to heat the glass frit to weld the first glass substrate to the first glass substrate. A hermetic seal dam is formed on and between two glass substrates.

[0110] The hermetic sealing method of the OLED element will be described in detail below using the screen printing process and the laser radiation heating technology. It should be understood that the frit paste composition and hermetic sealing technology described in the embodiments of the present invention are not limited to screen printing or laser radiation heating.

[0111] Hermetic sealing process, see figure 1 and figure 2 As shown, the details are as follows:

[0112] a) Preparation of frit paste composition

[0113] The above prepared gla...

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Abstract

The invention describes a lead-free frit based on a rare earth oxide doped Bi2O3-SiO2-ZnO glass system and a sealing method utilizing the frit paste composition. The frit and the sealing method have excellent sealing effect on water vapor and gas, and are easy for electrical component processing at low temperature. At the same time, the invention provides a method for hermetic glass sealing of electrical components. The method provides a first glass substrate and a second glass substrate and fixes the frit onto the first glass substrate, and then utilizes a radiation source (laser or infrared ray) to heat the frit and make it fuse, and a hermetic type sealing dam can be formed between the first glass substrate and the second glass substrate.

Description

technical field [0001] The present invention relates to a lead-free glass frit and a glass sealing method for hermetically sealing electrical components using the frit paste composition. The electrical components include organic light-emitting diodes (OLEDs), dye-sensitized solar cells (DSSCs), and lighting fixtures (LEDs). The present invention is illustrated using an OLED display as an example. Background technique [0002] Organic light emitting diode (Organic light emitting diode, OLED) is also called organic electroluminescent display, its structure belongs to sandwich structure, usually consists of anode, hole injection layer, hole transport layer, light emitting layer, electron transport layer and Composed of cathodes, etc., it is an all-solid-state display driven by current. Driven by the external current, electrons and hole carriers are injected into the conductive organic light-emitting layer, and then recombine in the light-emitting layer to form excitons, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/062
CPCC03C8/24
Inventor 谢再锋
Owner 谢再锋
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