Microwave device plating device and microwave device plating method for preventing secondary emission

Abstract

The invention relates to a microwave device plating device and a microwave device plating method for preventing secondary emission. The microwave device plating device is installed in a chamber of a magnetron sputtering machine. A motor at the bottom drives a revolving shaft to rotate and drives a bracket and a tray to make circumferential rotation around the revolving shaft. A gear on the bracket is meshed with a base gear rack to drive the bracket and the tray to rotate around a support shaft. A gear on the tray is meshed with a turret gear to drive the tray to rotate around a bracket shaft. All of the motions are combined to make the tray do complex spacial turnover movement. When in plating, a carbon target and a titanium target are installed in the chamber of the magnetron sputtering machine, after the targets are washed, workpieces to be plated are installed on the tray, the chamber is vacuumized and argon is introduced to perform sputter coating, and the workpieces make the spacial turnover movement along with the tray and receive sputtering irons in each direction during plating. By virtue of the device and method provided in the invention, uniform carbon film can be prepared on the surface of a different microwave device with very low secondary emission coefficient, the performance of microwave transmission is good, and the microdischarge phenomena can be effectively inhibited.

Description

technical field [0001] The invention relates to a surface coating treatment device and method, in particular to a microwave device surface coating treatment device and method for suppressing secondary electron emission. Background technique [0002] During the transmission of microwave signals in high-power microwave devices, the electrons in the microwave field will bombard the surface of the device under the action of microwave resonance, excite a large number of secondary electrons, form a micro-discharge effect, seriously reduce the microwave transmission performance, and even damage the Microwave devices themselves cause serious damage. [0003] In order to improve the suppression performance of secondary electron emission on the surface of microwave devices, the surface of existing microwave devices is mainly treated with nickel plating, gold plating, conductive oxidation and other surface treatments, and the secondary electron emission coefficient of the original mate...

AI Technical Summary

Problems solved by technology

[0005] At present, the magnetron sputtering coating method based on physical vapor deposition can be used to coat carbon film on the surface of microwave devices, but this type of carbon film is mainly used in the field of solid lubrication, and its secondary electron emission suppression ability cannot meet the requirements of micro discharge suppression. ; On the other hand, the clamping device used when coating the carbon film with a magnetron sputtering coating machine can only achieve a single direction of rotation, resulting in poor consistency of the coated carbon film, uneven film thickness, and cannot meet the microwave performance. Require

Images