Electroplating solution for pyrophosphate cyanide-free copper plating and electroplating method
A technology of pyrophosphate and cyanide-free copper plating, which is applied in the field of electroplating copper technology, can solve the problems of unsatisfactory performance of the plating solution and poor quality of the plating layer, and achieve excellent performance of the plating solution, good quality of the plating layer, and high cathode current efficiency Effect
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Embodiment 1
[0036] The formulation of the electroplating solution is as follows:
[0037]
[0038] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 50°C, and the electroplating time is 90min.
Embodiment 2
[0040] The formulation of the electroplating solution is as follows:
[0041]
[0042] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 25%, and the average current density is 0.7A / dm 2 ; The pH is 8.3, the temperature is 45°C, and the electroplating time is 70min.
Embodiment 3
[0044] The formulation of the electroplating solution is as follows:
[0045]
[0046] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 20%, and the average current density is 1.0A / dm 2 ; The pH is 8.5, the temperature is 35°C, and the electroplating time is 60min.
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