Dielectric isolation and junction isolation combined LIGBT (Lateral Insulated Gate Bipolar Transistor) device and manufacturing method
A technology of dielectric isolation and junction isolation, applied in the field of electronics, can solve the problems of the overall size of the device becoming larger, affecting the stability of the device, and the turn-off time becoming longer, so as to reduce the turn-off time, suppress the negative resistance effect and the negative resistance effect. the effect of elimination
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[0023] Specific embodiments of the present invention will be further described in detail below.
[0024] as attached Figure 4 As shown, the LIGBT device based on the combination of dielectric isolation and junction isolation has a buried oxide layer 2 on a silicon substrate 1; a drift region 3 is located on the buried oxide layer; one side of the drift region is a cathode region, and the other side is an anode region; In the P body region 4, there are cathode heavily doped P+ region 5 and cathode heavily doped N+ region 6; lightly doped N buffer region 7 under the anode P+ region 8, lightly doped P buffer region under the anode heavily doped N+ region 11 The region 10 and the P buffer region 10 do not completely surround the anode heavily doped N+ region 11, and the gap distance is d, which is adjustable. The anode P+ region 8 and the N+ region 11 are separated by a silicon dioxide dielectric 9; the upper part of the device is the cathode 12, the gate 13, and the anode 15; t...
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