Laser scribing method and system

Abstract

The invention provides a laser scribing method and a laser scribing system for cutting a material substrate transparent relative to laser wavelength. A laser beam is enabled to penetrate through and be focused on the bottom surface of the substrate, the laser beam is scanned according to a required route to cause the material on the bottom face of the substrate to be modified or laser scratch, then repeated scribing is carried out after the laser focusing point is shifted up for a predetermined height. The laser intensity adopted for scribing each time can vary from the height of the focusing points, and scribed lines are in uniform or non-uniform distribution in the thickness direction of the substrate. The scribing can be performed all the time until the laser focusing point is close to the upper surface of the substrate. Then a proper force is applied to the substrate, and the substrate is split along the scribed lines, thus scribing is finished. When pulse laser with the pulse width being smaller than 1ns is adopted, modification of the substrate material can be mainly material breakdown rather than thermally induced corrosion. According to the invention, the laser scribing system has corresponding hardware and control, can precisely focus the laser beam on the bottom face of the substrate, scribe lines according to a predetermined route, and then scribe lines by changing the height of the laser focusing point until finishing scribing.

Description

technical field [0001] The invention relates to a laser scribing method and a processing system for various film bases that are basically transparent to the adopted laser wavelength by using laser light. Background technique [0002] Compared with the traditional method of scribing with a grinding wheel or a diamond knife or a diamond wheel, laser scribing has the advantages of less pollution to the film substrate, smoother edge surface of the scribing line, and narrow scribing width so that the substrate area can be used more effectively. Especially for particularly brittle substrates, the traditional scribing with a grinding wheel or a diamond knife or a diamond wheel will cause irregular cracks in the substrate due to the mechanical force applied during scribing, making laser scribing almost the only s Choice. Due to the above-mentioned various advantages, laser scribing is increasingly widely used in the cutting and scribing of various semiconductor substrates, solar pa...

AI Technical Summary

Problems solved by technology

Its disadvantage is that the explosion caused by the laser inside the material itself does not have a clear directionality, and the cracks open irregularly to all directions in the film base, and the explosion products cannot escape to the outside, which further strengthens the impact on the film base. Random damage in direction

At the same time, because of this internal burst, the modification of the base material is limited to the inside of the base. When the base is broken by external force, the base is more likely to break along the non-predetermined scribing path, resulting in waste products.

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