Novel PTC thermosensitive element
A thermal element, a new type of technology, applied in the direction of resistors with positive temperature coefficients, etc., can solve the problems of small electrode resistance, low protection switch temperature, etc., and achieve the effect of small electrode resistance, low protection switch temperature, and large operating current
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Embodiment 1
[0033] like figure 2 Shown in the structural representation of this embodiment:
[0034] Press the conductive composite base layer 2 respectively figure 1 As shown, it is placed between the upper metal foil 11 and the lower metal foil 12, and they are closely combined by thermocompression. The temperature of hot pressing is 180 degrees centigrade, and the pressure is 12 MPa, and the time is 10 minutes, and finally cold pressing on the cold press for 10 minutes to obtain figure 1 A conductive composite chip with positive temperature coefficient of resistance effect shown. Then, through the punching process, the conductive composite material chip is punched into a small chip of 3mm*4mm, and then the small chip is welded with the upper and lower conductive parts 31 and 32 with a copper content of more than 99.9% through a reflow soldering process to form a PTC heat sink. Sensitive components, such as figure 2 .
Embodiment 2
[0036] This embodiment has the same structure and manufacturing process as Embodiment 1, except that the areas of the upper and lower conductive parts 31', 32' are the same size as the area of the chiplets.
Embodiment 3
[0038] This embodiment and embodiment 1 have the same structure and manufacturing process, except that the area of the upper conductive part 31'' is the same size as that of the small chip, and the lower conductive part 32'' is longer than the small chip, which is convenient for circuit connection.
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Abstract
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