Substrate processing method for supporting a catalyst particle for plating process
一种基板处理方法、催化剂的技术，应用在液态化学镀覆、涂层、印刷电路制造等方向，能够解决阶梯覆盖差、TSV应用障碍、薄膜制造成本昂贵等问题，达到密合性良好的效果
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no. 1 Embodiment approach
[0043] first embodiment : In this embodiment, Pd particles and a metal colloid solution are produced, a substrate on which TSVs have been formed is dipped and treated, and a plated layer is formed by electroless plating.
[0044] [Manufacture of Pd particles]
[0045] 1500 mL of pure water was placed in a separable flask having a capacity of 5 L, and 5.87 g of Pd chloride powder (Pd content: 32.89 mmol) was charged thereinto. At this time, Pd chloride was insoluble in water, and the solution was in a cloudy state. A sodium chloride solution in which 9.61 g of sodium chloride (5 times the molar equivalent of Pd) was dissolved in 1000 mL of pure water was added thereto, and stirred. During this process, the solution became brown while increasing its transparency, and became an orange transparent aqueous solution after stirring for 50 minutes.
[0046] A PVP aqueous solution (a solution in which 10.5 g of PVP was dissolved in 1000 mL of pure water) was added to this Pd chlori...
no. 2 Embodiment approach
[0059] 2nd embodiment : Here, the same substrate as in the first embodiment was treated using the Pd colloid solution produced in the first embodiment, and the bonding state of the Pd particles was confirmed in more detail. Also, a Co-W-B film as a metal film was formed by electroless plating.
[0060] The substrate used was a Si substrate formed with via holes (hole diameter: 2.5 μm, depth: 63 μm: aspect ratio: 25). On this substrate, SiO 2 layer and SAM. This substrate was immersed in a Pd colloid solution. The processing temperature at this time was 25 degreeC, and the immersion time was 10 minutes.
[0061] After the Pd particles were carried by the dipping treatment, the adsorption density (bonding number) of the Pd particles on the surface of the substrate and the inner surface of the via hole was calculated from the SEM photograph. show the result in Figure 4 . Depend on Figure 4 It was confirmed that the Pd colloidal solution of the first embodiment carried ...
no. 3 Embodiment approach
[0064] third embodiment: Here, Pd particles having different particle diameters and interplanar spacings of Pd(111) planes were produced. 2000 mL of pure water was placed in a separable flask, and 5.87 g of Pd chloride powder (Pd content: 32.89 mmol) was put thereinto. Then, stirring was performed while adding the same sodium chloride solution as in the first embodiment. A PVP aqueous solution (a solution in which 8.75 g of PVP was dissolved in 1500 mL of pure water) was added to this Pd chloride aqueous solution, and 875 mL of methanol was added. Thereafter, as in the first embodiment, the reaction solution is heated, stirred, and refluxed, concentrated, ultrafiltered, and filtered to recover Pd particles. The average particle size of the Pd particles obtained in this process is 4nm, and the interplanar distance of the Pd(111) plane is
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