Epoxy resin cured film with high grease content as well as preparation method and application of epoxy resin cured film
An epoxy resin curing and high-grease technology, applied in epoxy resin coatings, coatings, etc., can solve the problems of low use of renewable resources, low reaction efficiency, poor compatibility, etc., and achieve excellent thermal performance and simple process , low cost effect
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Embodiment 1～36
[0028]Add 5g of grease and the calculated amount of maleic anhydride to a 25mL disposable light-transmitting vial, and add a small amount of catalyst (such as di-tert-butyl peroxide), shake well, put it into a polytetrafluoroethylene reactor and Cover and seal. The reactor is placed on a polypropylene rotatable chassis and secured with bolts. Then put the whole device into Ethos MicroSYNTH 1600 type microwave synthesizer (Milestone Company, USA), and carry out microwave heating reaction while rotating. , the reaction pressure is controlled by the temperature of the closed system. Its product is light yellow thin transparent liquid to dark brown opaque liquid. The reaction conditions such as the proportion of reaction raw materials, reaction power, reaction time, amount of catalyst added, and whether to pressurize are shown in the table below. After the reaction was complete, vacuum was used to remove unreacted maleic anhydride. Under optimal conditions, the acid value of t...
Embodiment 37
[0036] Add maleated tung oil (embodiment 4) and epoxy fatty acid glycidyl ester (EGS) in 40mL light-transmitting vial, wherein epoxy group and acid anhydride ratio are 1:1, and add 2% of 1% reaction system gross weight -Methylimidazole, stirred at 50°C for 15min, then poured the mixture into a preheated silica gel mold and degassed for 15min, the degassing temperature was 50°C. It was placed in an oven, cured at 120°C for 4h and post-treated at 160°C for 1h. Finally, a light brown transparent epoxy resin cured film was obtained.
Embodiment 38
[0038] Add maleic anhydrided tung oil (Example 4) and epoxy methyl soylate in 40mL light-transmitting vial, wherein the ratio of epoxy group to acid anhydride is 1:1, and add 1% of the total weight of the reaction system 2-methyl imidazole, stirred at 50°C for 15min, then poured the mixture into a preheated silica gel mold and degassed for 15min at 50°C. It was placed in an oven, cured at 120°C for 4h and post-treated at 160°C for 1h. Finally, a light brown transparent epoxy resin cured film was obtained.
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