Adhesive, organic ceramic plate and preparation method of organic ceramic plate

A technology of organic ceramics and adhesives, which is applied in the field of preparation of adhesives, organic ceramic plates and organic ceramic plates. It can solve the problems of poor strength, poor deformation resistance, and no solution for organic ceramic plates to ensure molding , the effect of improving performance
CN104693684AInactive Publication Date: 2015-06-10LANGFANG GAOCI NEW MATERIALS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LANGFANG GAOCI NEW MATERIALS TECH CO LTD
Publication Date
2015-06-10
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention provides an adhesive, an organic ceramic plate and a preparation method of the organic ceramic plate. The adhesive comprises the following components in percentage by mass: 10-30% of epoxy resin, 10-30% of thermosetting phenol formaldehyde resin, 3-5% of latent curing agent, 0.5-1% of epoxy resin curing accelerator, 10-30% of inorganic filler, 10-20% of toughener, 0.5-2% of thixotropic agent, 0.5-2% of silane coupling agent and 35-45% of diluting solvent. When the adhesive is used in an organic ceramic plate preparation process, the adhesive and ceramic powder can be precured into a solid at low temperature (generally 50-80 DEG C), and pulverized into granules, thereby ensuring the smooth proceeding of the hot pressing of the organic ceramic plate. In the curing process of the plate subjected to hot pressing, the latent curing agent and epoxy resin curing accelerator can quickly cure the epoxy resin in a short time, thereby ensuring the formation of the organic ceramic plate and enhancing the performance of the formed organic ceramic plate.
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Description

technical field

[0001] The invention relates to the field of forming materials, in particular to an adhesive, an organic ceramic plate and a method for preparing the organic ceramic plate. Background technique

[0002] An organic ceramic board is an organic composite ceramic substrate that meets the requirements of a heat-conducting circuit board and is prepared at a low temperature (generally below 200°C) using heat-conducting ceramic powder and an organic binder as raw materials. It has high thermal conductivity, high insulation, and can meet the heat dissipation requirements of high-power LEDs, making it used as the substrate of organic ceramic-based copper-clad laminates, and widely used in electronics, communications, lighting, equipment and other fields.

[0003] Binder is an auxiliary used in the molding process of materials or products (such as organic ceramic plates) to help shape. Adhesives are often composed of multiple components, but the basic functional compon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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