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Adhesive, organic ceramic plate and preparation method of organic ceramic plate

A technology of organic ceramics and adhesives, which is applied in the field of preparation of adhesives, organic ceramic plates and organic ceramic plates. It can solve the problems of poor strength, poor deformation resistance, and no solution for organic ceramic plates to ensure molding , the effect of improving performance

Inactive Publication Date: 2015-06-10
LANGFANG GAOCI NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the existing adhesives (such as epoxy resin, phenolic resin, polyvinyl alcohol, etc.) cannot meet the production process of organic ceramic based copper clad laminates, that is, in the removal of the mixed slurry obtained by mixing ceramic powder and adhesive When the solvent is used, the mixed slurry cannot be pre-cured into a solid, and then it cannot be crushed into particles, and then it cannot be hot-pressed into a plate of uniform material, and the strength of the prepared organic ceramic plate is poor, and the thermal conductivity and high temperature resistance cannot reach normal. use level
At the same time, the glass transition temperature (Tg) of the existing adhesive system is low, and the resistance to deformation during the processing and use of printed circuit boards is poor
For the above problems, there is currently no effective solution

Method used

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Examples

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Effect test

preparation example Construction

[0033]The present invention also provides a method for preparing an organic ceramic plate, which includes the following steps: mixing ceramic powder with the binder provided by the present invention to obtain a mixed slurry; pre-curing the mixed slurry to remove the adhesive Diluting the solvent in the mixture to obtain a solid material; crushing the solid material into a mixed powder, and performing hot pressing on the mixed powder to obtain a plate; reflowing and solidifying the plate to obtain an organic ceramic plate.

[0034] In the above preparation method, the binder and the ceramic powder can be pre-cured into a solid at a low temperature (generally 50-80° C.), and then crushed into particles, thereby ensuring the smooth progress of the hot-press molding of the organic ceramic plate; During the curing process of the board obtained after pressing, the latent curing agent and the epoxy resin curing accelerator quickly cure the epoxy resin in a short time, ensuring the mol...

Embodiment 1

[0043] In terms of mass percentage, the adhesive provided in this embodiment includes the following components: 10% E44 epoxy resin, 20% 4,4'-diaminodiphenylmethane epoxy resin, 10% thermosetting phenolic resin , 5% of 4,4-diaminodiphenylsulfone, 1% of substituted urea, 10% of alumina, 10% of nitrile rubber, 0.5% of fumed silica, 0.5% of silane coupling agent ( KH-560), 33% ethyl acetate.

[0044] The preparation method of the organic ceramic board provided in this embodiment comprises the following steps: Al 2 o 3 The powder is mixed with the above binder to obtain a mixed slurry; the mixed slurry is pre-cured to remove the dilution solvent in the binder and obtain a solid material, wherein the pre-cured temperature is 60 ° C; the solid material is crushed into The powder is mixed, and the mixed powder is hot-pressed to obtain a plate; the plate is cured to obtain an organic ceramic plate, the curing temperature is 150° C., and the curing time is 10 minutes.

[0045] The t...

Embodiment 2

[0047] In terms of mass percentage, the adhesive provided by this embodiment comprises the following components: 5% E51 type epoxy resin, 5% p-aminophenol epoxy resin, 26.5% thermosetting phenolic resin, 3% dicyandiamide , 0.5% substituted urea, 11% alumina, 12% nitrile rubber, 1% fumed silica, 1% silane coupling agent (KH-560), 35% ethyl acetate.

[0048] The preparation method of the organic ceramic board provided in this example includes the following steps: mixing AlN powder with the above-mentioned binder to obtain a mixed slurry; pre-curing the mixed slurry to remove the diluent solvent in the binder and obtain a solid material, wherein the pre-curing temperature is 80°C; the solid material is crushed into a mixed powder, and the mixed powder is hot-pressed to obtain a plate; the plate is cured to obtain an organic ceramic plate, and the curing temperature is 120°C. The time is 15 minutes.

[0049] The thermal conductivity of the organic ceramic plate obtained in this e...

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Abstract

The invention provides an adhesive, an organic ceramic plate and a preparation method of the organic ceramic plate. The adhesive comprises the following components in percentage by mass: 10-30% of epoxy resin, 10-30% of thermosetting phenol formaldehyde resin, 3-5% of latent curing agent, 0.5-1% of epoxy resin curing accelerator, 10-30% of inorganic filler, 10-20% of toughener, 0.5-2% of thixotropic agent, 0.5-2% of silane coupling agent and 35-45% of diluting solvent. When the adhesive is used in an organic ceramic plate preparation process, the adhesive and ceramic powder can be precured into a solid at low temperature (generally 50-80 DEG C), and pulverized into granules, thereby ensuring the smooth proceeding of the hot pressing of the organic ceramic plate. In the curing process of the plate subjected to hot pressing, the latent curing agent and epoxy resin curing accelerator can quickly cure the epoxy resin in a short time, thereby ensuring the formation of the organic ceramic plate and enhancing the performance of the formed organic ceramic plate.

Description

technical field [0001] The invention relates to the field of forming materials, in particular to an adhesive, an organic ceramic plate and a method for preparing the organic ceramic plate. Background technique [0002] An organic ceramic board is an organic composite ceramic substrate that meets the requirements of a heat-conducting circuit board and is prepared at a low temperature (generally below 200°C) using heat-conducting ceramic powder and an organic binder as raw materials. It has high thermal conductivity, high insulation, and can meet the heat dissipation requirements of high-power LEDs, making it used as the substrate of organic ceramic-based copper-clad laminates, and widely used in electronics, communications, lighting, equipment and other fields. [0003] Binder is an auxiliary used in the molding process of materials or products (such as organic ceramic plates) to help shape. Adhesives are often composed of multiple components, but the basic functional compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L9/02C08K13/02C08K3/22C08K3/36C08G59/50C08G59/40C08G59/42C04B26/14
Inventor 王治虎王庆杰孙芳钟华宇
Owner LANGFANG GAOCI NEW MATERIALS TECH CO LTD
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