45results about How to "Reduce voltage overshoot" patented technology

An apparatus includes an inverter including a high-side switch coupled to a low-side switch, the inverter generating a time-varying drive current from a plurality of drive control signals, a positive rail voltage, and a negative rail voltage wherein controlling the switches to generate the time-varying drive current produces a potential transitory overshoot condition for one of the switches of the inverter; a drive control, coupled to the inverter, to generate the drive control signals and to set a level of each of the rail voltages responsive to a plurality of controller signals; and a controller monitoring one or more parameters indicative of the potential transitory voltage overshoot condition, the controller dynamically adjusting, responsive to the monitored parameters, the controller signals to reduce a risk of occurrence of the potential transitory voltage overshoot condition.

An apparatus includes an inverter including a high-side switch coupled to a low-side switch, the inverter generating a time-varying drive current from a plurality of drive control signals, a positive rail voltage, and a negative rail voltage wherein controlling the switches to generate the time-varying drive current produces a potential transitory overshoot condition for one of the switches of the inverter; a drive control, coupled to the inverter, to generate the drive control signals and to set a level of each of the rail voltages responsive to a plurality of controller signals; and a controller monitoring one or more parameters indicative of the potential transitory voltage overshoot condition, the controller dynamically adjusting, responsive to the monitored parameters, the controller signals to reduce a risk of occurrence of the potential transitory voltage overshoot condition.

An apparatus includes an inverter including a high-side switch coupled to a low-side switch, the inverter generating a time-varying drive current from a plurality of drive control signals, a positive rail voltage, and a negative rail voltage wherein controlling the switches to generate the time-varying drive current produces a potential transitory overshoot condition for one of the switches of the inverter; a drive control, coupled to the inverter, to generate the drive control signals and to set a level of each of the rail voltages responsive to a plurality of controller signals; and a controller monitoring one or more parameters indicative of the potential transitory voltage overshoot condition, the controller dynamically adjusting, responsive to the monitored parameters, the controller signals to reduce a risk of occurrence of the potential transitory voltage overshoot condition.

According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.

A system and method for controlling a grid-connected reactive power compensation inverter. The system uses a combination of feedforward and feedback controls to compute a reference voltage signal based on sensor-measured voltages and currents, where the reference voltage signal is used to control the inverter switches. The disclosed method modifies a cross-couple feedforward signal used in the reference voltage calculations, where the modified cross-couple signal includes a combination of both reference and actual currents, and the modified control scheme reduces the DC-link voltage overshoot experienced during a capacitive overload event while still providing the required reactive power and maintaining grid system stability.

The invention discloses a multi-chip wide bandgap power module packaging structure based on the interconnection of conductive metal clips, including power substrates, conductive metal clips, power terminals, drive terminals and electronic power semiconductor chips, suitable for multiple wide High-current level power modules with band-gap semiconductor power chips connected in parallel. A number of series or parallel power electronic power semiconductor chips are arranged on the conductive metal substrate on the upper surface of the power substrate; in the power circuit, a conductive metal clip is used to replace the traditional aluminum bonding wire to complete the electrical connection of the power circuit in the power module; the conductive metal The layout design of the clip greatly improves the distribution uniformity of the parasitic inductance of the parallel branch in the power module, achieving the effect of parallel chip current sharing; the same spacing between adjacent chips ensures that the heat dissipation conditions are almost the same, achieving the effect of chip temperature uniformity; The shape design of the conductive metal clip connector reduces the thermal-mechanical stress generated by the work and improves the reliability of the power module; the heat transfer capability of the conductive metal clip enables the power module to achieve a double-sided heat dissipation structure.