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Lead-free brazing filler metal

A lead-free solder, mass percentage technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of high melting point, weak oxidation resistance, poor wettability, etc., and achieve uniform tissue distribution , the effect of improving anti-oxidation and improving wettability

Inactive Publication Date: 2015-07-01
东莞腾马电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But unfortunately, the physical properties of the current lead-free solder are not ideal, such as: poor wettability, weak oxidation resistance, high melting point, easy yellowing of solder, uneven distribution of alloy structure, etc.

Method used

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Examples

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Embodiment 1

[0040] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0041] 0.7% Cu;

[0042] 0.05%Ni;

[0043] 0.025% Ge;

[0044] 1.2% Bi;

[0045] The balance is Sn.

Embodiment 2

[0047] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0048] 0.5% Cu;

[0049] 0.07%Ni;

[0050] 0.02% Ge;

[0051] 0.5% Bi;

[0052] The balance is Sn.

Embodiment 3

[0054] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0055] 0.7% Cu;

[0056] 0.05%Ni;

[0057] 0.01% Ge;

[0058] 1.5% Bi;

[0059] The balance is Sn.

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Abstract

The invention belongs to the technical field of brazing filler metal and relates to lead-free brazing filler metal. The lead-free brazing filler metal is composed of, by mass, 0.5% to 4.0% of Cu, 0.04% to 0.2% of Ni, 0.005% to 1.0% of Ge, 0.05% to 2.0% of Bi and the balance Sn. Compared with the prior art, 0.005% to 1.0% of Ge and 0.05% to 2.0% of Bi are added to the brazing filler metal, structure distribution of the brazing filler metal can be even, and the melting point and the melting range of brazing filler metal alloy are reduced; due to the fact that germanium is high in oxyphile skin effect and can be concentrated on the surface of the melting brazing filler metal, the brazing filler metal is prevented from being further oxidized. Thus, oxidization resistance of the brazing filler metal can be remarkably improved by adding tiny germanium and the brazing filler metal is prevented from becoming yellow. In addition, the moisture and the tensile strength of the brazing filler metal can be remarkably improved by adding tiny germanium.

Description

technical field [0001] The invention belongs to the technical field of solder and relates to a lead-free solder. Background technique [0002] In solder alloys, lead is generally an important metal used to dilute tin to improve fluidity and wettability. The traditional solder mainly uses the Sn63-Pb37 eutectic composition as the basic alloy system. The eutectic temperature of this alloy is 183°C. It has good mechanical properties and process properties. It has a long history of use and has accumulated a lot of production and practical experience. However, lead is a toxic heavy metal. When the waste electronic appliances are landfilled, the lead in the solder can be transformed into divalent lead ions that can dissolve in water when it encounters acid rain or groundwater, and then enters people's water supply chain, causing lead pollution. poisoned. [0003] Therefore, people have gradually begun to study lead-free solders. At present, some results have been obtained, and s...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 杜老乙
Owner 东莞腾马电子有限公司
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