Unleaded brazing filler metal

A lead-free solder, mass percentage technology, applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of high melting point, poor wettability, unsatisfactory physical properties, etc., and achieve tissue distribution Uniform, wettability-improving effect

Inactive Publication Date: 2017-02-22
DONGGUAN GUANGXIN INTPROP SERVICES CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But unfortunately, the physical properties of the current lead-free solder are not ideal, such as: poor wettability, weak oxidation resistance, high melting point, easy yellowing of solder, uneven distribution of alloy structure, mechanical properties Poor etc.

Method used

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  • Unleaded brazing filler metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0054] 0.7% Cu;

[0055] 0.05%Ni;

[0056] 0.025% Ge;

[0057] 1.2% Bi;

[0058] 1.0% Zn;

[0059] 0.2% Ce;

[0060] 0.1% Er;

[0061] The balance is Sn.

Embodiment 2

[0063] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0064] 0.5% Cu;

[0065] 0.07%Ni;

[0066] 0.02% Ge;

[0067] 0.5% Bi;

[0068] 0.5% Zn;

[0069] 0.1% Ce;

[0070] 0.07 Er;

[0071] The balance is Sn.

Embodiment 3

[0073] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:

[0074] 0.8% Cu;

[0075] 0.08%Ni;

[0076] 0.01% Ge;

[0077] 0.15% Bi;

[0078] 1.5% Zn;

[0079] 0.03% Ce;

[0080] 0.03% Er;

[0081] The balance is Sn.

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PUM

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Abstract

The invention relates to an unleaded brazing filler metal, and belongs to the technical field of brazing filler metal. The brazing filler metal is prepared from, by mass, 0.3%-1.0% of Cu, 0.01%-0.11% 0f Ni, 0.005%-0.10% of Ge, 0.05%-2.0% of Bi, 0.05%-2.0% of Zn, 0.005%-0.5% of Ce, 0.005%-0.3% of Er and the balance Sn. Compared with the prior art, tissue distribution of alloy of the unleaded brazing filler metal is uniform; in addition, the unleaded brazing filler metal has functions of anti-oxidation and stain inhibiting, and has good wettability, good mechanical property and low melting point at the same time.

Description

technical field [0001] The invention belongs to the technical field of solder and relates to a lead-free solder. Background technique [0002] In solder alloys, lead is generally an important metal used to dilute tin to improve fluidity and wettability. The traditional solder mainly uses the Sn63-Pb37 eutectic composition as the basic alloy system. The eutectic temperature of this alloy is 183°C. It has good mechanical properties and process properties. It has a long history of use and has accumulated a lot of production and practical experience. However, lead is a toxic heavy metal. When the waste electronic appliances are landfilled, the lead in the solder can be transformed into divalent lead ions that can dissolve in water when it encounters acid rain or groundwater, and then enters people's water supply chain, causing lead pollution. poisoned. [0003] Therefore, people have gradually begun to study lead-free solders. At present, some results have been obtained, and s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 刘丽蓉王勇丁超
Owner DONGGUAN GUANGXIN INTPROP SERVICES CO LTD
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