Unleaded brazing filler metal
A lead-free solder, mass percentage technology, applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of high melting point, poor wettability, unsatisfactory physical properties, etc., and achieve tissue distribution Uniform, wettability-improving effect
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Embodiment 1
[0053] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:
[0054] 0.7% Cu;
[0055] 0.05%Ni;
[0056] 0.025% Ge;
[0057] 1.2% Bi;
[0058] 1.0% Zn;
[0059] 0.2% Ce;
[0060] 0.1% Er;
[0061] The balance is Sn.
Embodiment 2
[0063] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:
[0064] 0.5% Cu;
[0065] 0.07%Ni;
[0066] 0.02% Ge;
[0067] 0.5% Bi;
[0068] 0.5% Zn;
[0069] 0.1% Ce;
[0070] 0.07 Er;
[0071] The balance is Sn.
Embodiment 3
[0073] In terms of mass percentage, the lead-free solder provided by this embodiment consists of the following components:
[0074] 0.8% Cu;
[0075] 0.08%Ni;
[0076] 0.01% Ge;
[0077] 0.15% Bi;
[0078] 1.5% Zn;
[0079] 0.03% Ce;
[0080] 0.03% Er;
[0081] The balance is Sn.
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