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A sputtering system

A sputtering system and sputtering source technology, applied in the field of sputtering systems, can solve the problems of reducing deposition rate, affecting production efficiency, etc., and achieve the effects of increasing sputtering rate, quality, and film-forming rate

Active Publication Date: 2015-07-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the connection of target 2 to RF power will reduce the deposition rate and affect production efficiency

Method used

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  • A sputtering system
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Embodiment Construction

[0023] In order for those skilled in the art to better understand the technical solution of the present invention, the sputtering system provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0024] figure 2 It is a schematic structural diagram of a sputtering system according to an embodiment of the present invention. Such as figure 2 As shown, the sputtering system includes a chamber 11 , a sputtering source 12 , a susceptor 13 , a vacuum system 14 and a process gas supply system 15 . The sputtering source 12 is arranged on the sidewall of the chamber 11, the base 13 is arranged on the bottom in the chamber 11, the vacuum system 14 is used to adjust the vacuum degree in the chamber 11, and the process gas supply system 15 is used to supply the chamber 11 Provide the process gas needed to implement the process, such as Ar gas.

[0025] The sputtering system of this embodiment is provided with two sputtering sour...

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Abstract

A sputtering system is provided. The sputtering system comprises a cavity, sputtering sources and a base. Plasma is produced in the cavity. The base is used for bearing a substrate. The sputtering system comprises at least one pair of the sputtering sources, and the sputtering sources in each pair are oppositely disposed. The base is disposed in the cavity and outside a plasma zone. The sputtering system is high in sputtering speed, low in damage to film and capable of achieving low-temperature sputtering.

Description

technical field [0001] The invention belongs to the field of semiconductor processing and relates to a sputtering system. Background technique [0002] Thin film deposition technology is a technology widely used in the field of semiconductor technology, such as insulating layers and metallized conductive layers are obtained through thin film deposition technology. Physical vapor deposition equipment is a common equipment for thin film deposition technology, which obtains thin films by evaporation, ion beam, sputtering and other means. Among them, the sputtering method has the characteristics of fast deposition rate, good compactness and high purity of the obtained film, and is widely used in the industry. [0003] figure 1 It is a schematic diagram of the mechanism of a secondary sputtering device for preparing thin films by sputtering. Such as figure 1 As shown, the secondary sputtering equipment includes a chamber 3 , a target 2 and a base 4 for carrying a substrate 7 ...

Claims

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Application Information

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IPC IPC(8): C23C14/46
Inventor 边国栋
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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