Imaging three dimensional substrates using a transfer film

一种三维、衬底的技术，应用在用于光机械设备的光敏材料、对表面涂布液体的装置、图纹面的照相制版工艺等方向，能够解决影响图像分辨率等问题，达到减少工艺步骤、改善分辨率和速度、有效三维衬底成像的效果

Inactive Publication Date: 2015-07-01
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The weakness of this method is that the use of heat and pressure on the ink affects the resolution of the image

Method used

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  • Imaging three dimensional substrates using a transfer film
  • Imaging three dimensional substrates using a transfer film
  • Imaging three dimensional substrates using a transfer film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0050] The following inkjet etch resist compositions were prepared:

[0051] Table 1

[0052]

[0053]

[0054]

[0055] 1 Acrylates from Cytec Industries

[0056] 2 Typical composition and characteristics: abietic acid <3wt%, dehydroabietic acid 6-10wt%, dihydroabietic acid 60-80wt%, tetrahydroabietic acid 5-15wt%, other resin acids and neutrals 10-15wt% %, softening point, Ring&Ball, ℃.=65-69, acid number 158-160

[0057] 3 Hercolyn Floral AX-E from Pinova solutions Inc.

[0058] 4 Hercolyn D-methylhydrorosinate from Pinova solutions Inc.

[0059] All formulations in Table 1 were prepared in the same way. The monomer, wax, plasticizer, and photoinitiator are mixed together at room temperature using conventional laboratory mixing equipment. Formula is 100% solids. The mixture was then heated in a conventional convection oven at a temperature ranging from 85°C to 90°C. The heated resist was then filtered through a conventional laboratory 1.5µ metal filt...

Embodiment 6

[0063] The method described in Example 5 was repeated on multiple copper-clad FR4 / glass epoxy three-dimensional curved panels in thicknesses of 15 μm-30 μm, except that the resist compositions were those prepared in Examples 2-4. The film is selected from polyester, polyethylene terephthalate (PET), polyimide (PI), polyolefin, polycarbonate, polyacrylate and ethylene vinyl acetate. The film does not contain any release agent. Each formulation was ink jetted onto each UV transparent film to form a pattern using the equipment and method described in Example 5. The film with the resist composition is then applied to the curved plate such that the resist is in contact with the curved plate. Each film was gently pressed and rolled with a squeegee to remove air under the film and allow the resist to adhere to the plate. UV light is applied to the film and the film is peeled off the plate. All resists cured and adhered to the board as expected. No resist remained on the membrane ...

Embodiment 7-13

[0066] Table 2

[0067]

[0068]

[0069] The seven resist formulations in Table 2 were all prepared in the same way. Using conventional laboratory mixing equipment, the monomer, acid wax, and free radical initiator mixture are brought together to form a homogeneous mixture. The mixture is heated in a conventional convection oven at 50°C to 90°C to liquefy components that cannot be mixed with other components due to their solid form. After mixing the individual components, cool to room temperature to form a 100% solids composition. The composition is expected to have an acid number greater than 100 mgKOH / g.

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Abstract

Actinic radiation curable inks are selectively applied to flexible films which allow the transmission of actinic radiation and then are applied such that the side of the flexible films on which the curable inks are applied contact surfaces of three dimensional substrates. Actinic radiation is applied to the flexible films which cause the ink to cure on the three dimensional substrate. The flexible films are removed leaving the cured ink on the substrates.

Description

technical field [0001] The present invention relates to the formation of images on three-dimensional substrates by inkjet printing of actinic radiation curable resist compositions using transfer films. More particularly, the present invention relates to the formation of an image on a three-dimensional substrate by inkjet printing of an actinic radiation curable resist composition using a transfer film, which is effective and wherein the image has improved resolution. Background technique [0002] Some substrates have three-dimensional surfaces on which imaging is challenging. For example, a unique imaging support is used in the gravure printing industry, which is usually made of steel or aluminum based cylinders. The cylinder is electroplated with copper and then chemically etched or electromechanically engraved so that the printed area is below the surface of the cylinder. In the imaging area, there are thousands of micro-sized elements to be etched or engraved into the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F7/027G03F7/004
CPCB05D2502/005B05D7/24G03F7/24G03F7/18G03F7/2018
Inventor K·巴兰特拉普R·K·巴尔B·D·阿莫斯
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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