Electrostatic chuck and reaction chamber

A technology of electrostatic chuck and reaction chamber, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as processing difficulties, achieve the effects of reducing processing difficulty, solving thermal expansion and heat insulation problems, and reducing processing difficulty
CN104752300BActive Publication Date: 2018-09-18BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2018-09-18

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Abstract

The invention provides a static chuck and a reaction cavity. The static chuck comprises a static chuck assembly, a cooling part, a supporting heat-insulation part and a sealing heat-insulation part, wherein the static chuck assembly is located above the cooling part, and the supporting heat-insulation part is arranged between the static chuck assembly and the cooling part and used for supporting the static chuck assembly. The sealing heat-insulation part is of a corrugated annular thin-wall structure, is arranged between the static chuck assembly and the cooling part and is wound around the outer side of the supporting heat-insulation part. The sealing heat-insulation part is connected with the static chuck assembly and the cooling part respectively in a sealing mode, a separation space is formed between the sealing heat-insulation part and the supporting heat-insulation part and is used for leading out a lead inside the static chuck assembly. The problems of thermal expansion and heat insulation at a high-temperature stage can be effectively solved, meanwhile the machining difficulty of the static chuck is reduced, and the lead inside the static chuck can be conveniently led out.
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Description

technical field

[0001] The invention relates to the technical field of microelectronic processing, in particular to an electrostatic chuck and a reaction chamber. Background technique

[0002] In the field of semiconductor processing, generally in a vacuum reaction chamber, reactive materials are formed on the wafer surface by etching (Etch) process or chemical vapor deposition (CVD) process. During this process, the wafer can be fixed on a specific position in the vacuum reaction chamber by a mechanical clamping device or an electrostatic chuck (ESC), and the process gas is transported into the vacuum reaction chamber through the pipeline, while the vacuum reaction chamber A radio frequency (RF) field in the chamber energizes the process gas into a plasma state. In the semiconductor production process, chucks are used to fix and support wafers to prevent wafer movement or misalignment during processing. Chucks may include mechanical chucks, vacuum chucks, or electrostatic...

Claims

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