A kind of preparation method of desulfurization nozzle and its forming device
A technology of desulfurization nozzle and mold release agent, which is applied to ceramic forming cores, ceramic forming machines, ceramic forming mandrels, etc., can solve the problems of difficult forming, many curved surfaces, complex shapes, etc., and achieves good quality consistency, low cost, The device has a simple effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment 1
[0067] A method for preparing a low-cost desulfurization nozzle, comprising the following steps:
[0068] (1), first smear release agent to the inner surface of outer mold and the outer surface of inner mould, then outer mold and outer mold are affixed by clamping pin 4 to form forming mould,
[0069] (2), 50 parts of silicon carbide sand, 25 parts of modified silicon powder, 3 parts of silicon nitride powder, 1 part of aluminum oxide, 0.5 part of vanadium oxide, 0.1 part of copper powder, 0.1 part of sodium tannate, 0.1 part of humic acid Sodium is added to the ball mill, mixed according to the ratio of material: ball = 1:1.5 and ball milled for 3 hours, then passed through a 5-mesh sieve, and the ground balls are sieved to obtain the mixed powder;
[0070] (3) Install the outer mold first, then put the inner mold into the outer mold, fill the gap between the outer mold and the inner mold with the powder obtained in step (2), and install the blocking material circular plate a...
specific Embodiment 2
[0111] A method for preparing a low-cost desulfurization nozzle, comprising the following steps:
[0112] (1), first smear release agent to the inner surface of outer mold and the outer surface of inner mould, then outer mold and outer mold are affixed by clamping pin 4 to form forming mould,
[0113] (2), 75 parts of silicon carbide sand, 40 parts of modified silicon powder, 8 parts of silicon nitride powder, 5 parts of alumina, 2 parts of vanadium oxide, 1 part of copper powder, 0.3 parts of sodium tannate, 0.3 parts of humic acid Sodium is added to the ball mill, mixed according to the ratio of material: ball = 1:2, ball milled for 3 hours, passed through a 5-mesh sieve, and sieved to remove the grinding balls to obtain the mixed powder;
[0114] (3) Install the outer mold first, then put the inner mold into the outer mold, fill the gap between the outer mold and the inner mold with the powder obtained in step (2), and install the blocking material circular plate and cover ...
specific Embodiment 3
[0153] A method for preparing a low-cost desulfurization nozzle, comprising the following steps:
[0154] (1), first smear release agent to the inner surface of outer mold and the outer surface of inner mould, then outer mold and outer mold are affixed by clamping pin 4 to form forming mould,
[0155] (2), 60 parts of silicon carbide sand, 30 parts of modified silicon powder, 5 parts of silicon nitride powder, 3 parts of aluminum oxide, 1 part of vanadium oxide, 0.5 part of copper powder, 0.2 part of sodium tannate, 0.2 part of humic acid Sodium is added to the ball mill, mixed according to the ratio of material: ball = 1:1.8 and ball milled for 3 hours, then passed through a 5-mesh sieve, and the ground balls are sieved to obtain the mixed powder;
[0156] (3) Install the outer mold first, then put the inner mold into the outer mold, fill the gap between the outer mold and the inner mold with the powder obtained in step (2), and install the blocking material circular plate an...
PUM
Property | Measurement | Unit |
---|---|---|
flexural strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com