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Epoxy resin composite material, preparation method and application

A technology of epoxy resin and composite materials, which is applied in the field of thermal interface materials, can solve problems such as low viscosity, high viscosity, and poor thermal conductivity, and achieve the effects of reducing viscosity, improving interaction, and submitting heat exchange efficiency

Active Publication Date: 2015-07-22
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides an epoxy resin composite material, its preparation method and application, the purpose of which is to prepare composite materials with low viscosity and Epoxy resin-based composite materials with high thermal conductivity, thus solving the technical problems of high viscosity or poor thermal conductivity of existing epoxy resin materials

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  • Epoxy resin composite material, preparation method and application
  • Epoxy resin composite material, preparation method and application

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Effect test

Embodiment 1

[0042] A kind of epoxy resin composite material, the inorganic filler of 30% volume ratio is uniformly dispersed in epoxy resin, and described inorganic filler comprises large particle diameter inorganic filler and small particle diameter inorganic filler, and the average of described large particle diameter inorganic filler The particle size is 6.3 microns, the average particle size of the small particle size inorganic filler is 500nm, and the volume ratio of the large particle size inorganic filler to the small particle size inorganic filler is 7:3. The inorganic filler with large particle size is aluminum nitride; the inorganic filler with small particle size is aluminum nitride.

[0043]The thermal conductivity of the epoxy resin composite material is tested according to the test standard ASTM C1113, and its thermal conductivity is 0.63W / m·K, and its viscosity is tested according to the test standard Anton Paar MCR302, which is 3.8Pa·s at 25°C.

[0044] An epoxy resin comp...

Embodiment 2

[0053] A kind of epoxy resin composite material, the inorganic filler of 30% volume ratio is uniformly dispersed in epoxy resin, and described inorganic filler comprises large particle diameter inorganic filler and small particle diameter inorganic filler, and the average of described large particle diameter inorganic filler The particle size is 6.3 microns, the average particle size of the small particle size inorganic filler is 500nm, and the volume ratio of the large particle size inorganic filler to the small particle size inorganic filler is 8:2. The inorganic filler with large particle size is aluminum nitride; the inorganic filler with small particle size is aluminum nitride.

[0054] The thermal conductivity of the epoxy resin composite material is tested according to the test standard ASTM C1113, and its thermal conductivity is 0.63W / m·K, and its viscosity is tested according to the test standard Anton Paar MCR302, which is 5.0 Pa·s at 25°C.

[0055] An epoxy resin co...

Embodiment 3

[0075] An epoxy resin composite material, in which an inorganic filler with a volume ratio of 70% is uniformly dispersed in the epoxy resin, and the inorganic filler includes a large particle size inorganic filler and a small particle size inorganic filler, and the average of the large particle size inorganic filler is The particle size is 50 microns, the average particle size of the small particle size inorganic filler is 500 nm, and the volume ratio of the large particle size inorganic filler to the small particle size inorganic filler is 9:1. The inorganic filler with a large particle size is alumina; the inorganic filler with a small particle size is silicon dioxide.

[0076] The thermal conductivity of the epoxy resin composite material is tested according to the test standard ASTM C1113, and its thermal conductivity is 1.1 W / m·K, and its viscosity is tested according to the test standard Anton Paar MCR302, which is 19.2 Pa·s at 25°C.

[0077] An epoxy resin composite mat...

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Abstract

The invention discloses an epoxy resin composite material, a preparation method and application. According to the epoxy resin composite material, inorganic packing of which the volume ratio is 15-17% is uniformly dispersed in epoxy resin, the inorganic packing comprises large-particle-size inorganic packing and small-particle-size inorganic packing, the average particle size of the large-particle-size inorganic packing is within 2-50mu m, the average particle size of the small-particle-size inorganic packing is within 50-500nm, and the volume ratio of the large-particle-size inorganic packing to the small-particle-size inorganic packing is within 5:5 to 9:1. The preparation method comprises the following steps: (1) sufficiently drying the large-particle-size inorganic packing and the small-particle-size inorganic packing, and uniformly mixing, thereby obtaining mixed packing; (2) adding the mixed packing into the epoxy resin, uniformly dispersing, defoaming, and curing, thereby obtaining the epoxy resin composite material. The epoxy resin composite material disclosed by the invention is both high in heat conduction property and low viscosity, and is particularly applicable to electronic packaging materials.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and more specifically relates to an epoxy resin composite material, its preparation method and application. Background technique [0002] With the continuous improvement of nano-manufacturing technology and process level, integrated circuits are developing towards high integration and miniaturization, which leads to the continuous increase of heat flux density of chips and integrated circuits. Thermally conductive and insulating packaging materials with high heat dissipation performance are the key links to improve the working stability and service life of electronic components. Plastic packaging is widely used in the field of thermal interface materials and electronic packaging due to its excellent electrical insulation performance, processing performance and cost advantages. Among them, epoxy resin has the advantages of low shrinkage, good bonding performance, and good corrosion resis...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/28C08K3/22C08K3/36C08K3/38
Inventor 解孝林吴敬一周兴平薛志刚陈超
Owner HUAZHONG UNIV OF SCI & TECH
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