Unlock instant, AI-driven research and patent intelligence for your innovation.

Package assembling structure, forming method thereof and package assembling method

A technology for assembling structures and packaging parts, which is applied in the fields of semiconductor/solid-state device components, electrical components, and electrical solid-state devices. The effect of reducing the difficulty of position calibration

Active Publication Date: 2015-07-22
CHINA WAFER LEVEL CSP
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The design of circular packages or other packages that are difficult to align has caused great problems for the later assembly of packages, resulting in large errors in the placement process and low yield of the formed devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package assembling structure, forming method thereof and package assembling method
  • Package assembling structure, forming method thereof and package assembling method
  • Package assembling structure, forming method thereof and package assembling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] It can be seen from the background art that in the prior art, when the package is assembled later, the error of the mounting process is large, resulting in a low yield rate of the manufactured device.

[0034] After research, it was found that during the process of moving the package to the designated position for the placement process, the package has a displacement relative to the carrier board, resulting in a position deviation of the package that is sucked out. The position deviation refers to The most important thing is that, taking a certain point in the package as the reference coordinate, the difference between the position of the package before moving the package and the position of the package taken out; therefore, after the package is taken out and before the placement process, it is necessary to The package is aligned to improve the accuracy of the placement process.

[0035] When the package is a circular package or other packages that are difficult to determ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a package assembling structure, a forming method thereof and a package assembling method. The package assembling structure comprises a bearing plate and a package, wherein a plurality of projections are arranged on the surface of the bottom of the bearing plate; the package is placed on the surface of the bottom of the bearing plate and comprises a substrate, a chip, a wire and plastic packaging layers; the substrate is placed on the surface of the bottom of the bearing plate and is provided with a front surface and a back surface opposite to the front surface; a plurality of blind holes are formed in the back surface of the substrate; the projections are positioned in the blind holes and are inlaid in the blind holes; a plurality of first welding pads are formed on the front surface of the substrate; the chip is positioned on the front surface of the substrate; a second surface of the chip is positioned on the front surface of the substrate; a plurality of second welding pads are arranged on a first surface of the chip; two ends of the wire are respectively connected with the first welding pads and the second welding pads electrically; and the plastic packaging layers are positioned on the front surface of the substrate, the first surface of the chip and surfaces of side walls of the chip. By the package assembling structure, the accuracy of a surface-mounting technology is improved, and the yield of a manufactured device is improved effectively.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a package assembly structure, a forming method thereof, and a package assembly method. Background technique [0002] Grid array package (LGA, Land Grid Array) adopts point contact technology (contact), which uses metal contact package technology to replace the previous needle pin package technology, and makes a package with arrayed electrode contacts on the bottom surface key, and the surface mount technology (SMT, Surface Mounted Technology) can be used for mounting during assembly. [0003] The general process of LGA packaging includes: figure 1 as shown, figure 1 It is a top view structure schematic diagram of the package 10, the capacitor 1, the resistor 2, the inductor 3 and the chip 4 with different functions are placed in the corresponding functional area on the surface of the PCB substrate 5 through the SMT mounting process; The pads on the PCB subs...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/13H01L23/488H01L21/48H01L21/58H01L21/60
CPCH01L24/97H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00
Inventor 王之奇杨莹王蔚
Owner CHINA WAFER LEVEL CSP