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Alkali-developable photosensitive resin composition, dry film and cured product, and printed circuit board

A photosensitive resin, alkali developing technology, used in printed circuit parts, optics, photography, etc., can solve the problems of chemical tin plating resistance and insufficient chemical gold plating resistance of the resin composition, and achieve the effect of excellent chemical gold plating resistance.

Active Publication Date: 2017-11-24
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned resin composition has insufficient resistance to chemical tin plating and chemical gold plating.

Method used

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  • Alkali-developable photosensitive resin composition, dry film and cured product, and printed circuit board
  • Alkali-developable photosensitive resin composition, dry film and cured product, and printed circuit board
  • Alkali-developable photosensitive resin composition, dry film and cured product, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0121] Substrate production conditions:

[0122] According to the composition shown in Table 1, each component was mixed with the dissolver, and it was made to disperse uniformly, and curable resin composition was obtained. Using a 100-mesh polyester screen, the composition was coated on the entire surface with a thickness of 20 to 30 μm on a patterned copper through-hole printed circuit board by a screen printing method. Next, the coating film was dried for 30 minutes using a hot air circulation drying oven at 80° C., and tests for dryness to touch and developability were performed by the test method and evaluation method described later.

[0123] Next, a negative film having a resist pattern is closely bonded to the coating film, and an ultraviolet exposure device (manufactured by ORCMANUFACTURING CO., LTD., model HMW-680GW) is used to irradiate ultraviolet rays (exposure amount: 300mJ / cm 2 ), followed by developing for 60 seconds with 1 wt % sodium carbonate aqueous soluti...

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Abstract

The present invention provides an alkali-developing photosensitive resin composition, a dry film, a cured product, and a printed circuit board. This alkali-developing photosensitive resin composition is characterized in that it contains: (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a thermosetting component, (D) a thermosetting accelerator, and (E ) barite.

Description

technical field [0001] The present invention provides an alkali-developing photosensitive resin composition which has various properties such as dry-to-touch, adhesiveness, solder heat resistance, and solvent resistance, and is excellent in electroless tin plating resistance and electroless gold plating resistance. Furthermore, the dry film formed using this alkali-developing type photosensitive resin composition, the hardened|cured material formed using this alkali-developing type photosensitive resin composition or its dry film, and the printed wiring board which has this hardened|cured material are provided. Background technique [0002] In general, as solder resists for consumer printed circuit boards and industrial printed circuit boards, from the viewpoint of high precision and high density, solder resists that form an image after being irradiated with ultraviolet rays and then heat-cured (completely cured) are used , Out of concerns about environmental issues, instead...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/09H05K1/02
CPCC09D11/10C09D11/03C09D11/101G03F7/027G03F7/033
Inventor 米元护浦国斌
Owner TAIYO INK SUZHOU
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