Photo-cured and heat-cured resin composition and pcondensate thereof

A resin composition, thermosetting technology, applied in the fields of adhesion, chemical resistance, moisture resistance and heat resistance of various substrates, can solve the problems of solder resist peeling, coating film residue, negative film traces, etc. The effect of excellent electrical insulation and excellent resistance to electroless tin plating

Active Publication Date: 2009-03-25
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the recent surface treatment of printed wiring boards, electroless tin plating is increasingly performed compared with electroless gold plating from the viewpoint of advantages in terms of cost and chemical safety.
However, since electroless tin plating is displacement plating, there are pits in the copper at the interface between the solder resist and copper, and there is a problem that the solder resist peels off from there.
On the other hand, in the case of a solder resist composition excellent in electroless tin plating resistance, there is usually a problem in dryness to the touch (hand-free property), and after exposure of the once-dried coating film to the negative film, there is The problem of leaving traces of the negative film in the coating film

Method used

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  • Photo-cured and heat-cured resin composition and pcondensate thereof
  • Photo-cured and heat-cured resin composition and pcondensate thereof
  • Photo-cured and heat-cured resin composition and pcondensate thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In the combinations shown in Table 1, the respective components were mixed in a dissolver and uniformly dispersed to obtain a photocurable / thermosetting resin composition. The composition was coated on the entire surface of a patterned copper through hole printed circuit board using a 100-mesh polyester screen with a thickness of 20 to 30 μm by a screen printing method. Next, the coating film was dried for 30 minutes using a hot air circulation drying oven at 80° C., and tests for dryness to touch and developability were performed by the test method and evaluation method described later.

[0055] Next, a negative film having a resist pattern was adhered to the coating film, and ultraviolet light was irradiated (exposure amount: 300 mJ / cm 2 ), followed by development in 1 wt% sodium carbonate aqueous solution with a spray pressure of 0.2 MPa for 60 seconds. Thereafter, heat and solidify in a hot air circulation drying oven at 150°C for 60 minutes, and cool to room tempe...

Embodiment 2～7 and comparative example 1、2

[0092] Except for making the formula combination shown in Table 3, the same operation was carried out as in the aforementioned Example 1 to prepare a photocurable and thermosetting resin composition, and the dryness to touch, developability, solder heat resistance and Test for resistance to electroless tin plating. The results are shown in Table 4.

[0093] table 3

[0094]

[0095]

[0096] Table 4

[0097]

[0098] As can be seen from the results shown in Table 4 above, the cured film formed from the photocurable / thermosetting resin composition of the present invention is excellent in dry-to-touch properties, developability, solder heat resistance, and electroless tin plating resistance. On the other hand, in the case of Comparative Examples 1, 2, and 4, which do not contain a carboxyl group-containing photosensitive resin having a phenol novolak-type skeleton as the carboxyl group-containing photosensitive resin, the developability and electroless tin plating res...

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Abstract

The invention provides a light curing and thermal curing resin composition which can not produce the problem of touch drying deterioration, and form curing coating pattern with good chemical tinning resistance, curing material, and printed circuit board formed of solder mask made of the curing material. The light curing and thermal curing resin composition comprises (A) carboxyl containing photosensitive resin obtained from the reaction between the reaction product of phenol phenolic varnish type epoxy resin and unsaturated monocarboxylate and saturated or unsaturated multi-anhydride, (B) other carboxyl containing photosensitive resin except for (A), (C) photopolymerization initiator, (D) diluent, and (E) thermal curing composition, the ratio of (A) and (B) is 50 to 95:50 to 5 (mass ratio). Moreover, (F) curing accelerant is comprised, or barium sulfate and/or silicon dioxide is used as inorganic filler.

Description

technical field [0001] The present invention relates to a photocurable and thermosetting resin composition suitable for forming a solder resist layer of a printed wiring board, and a cured product thereof, and more specifically, to a coating film capable of being dry to the touch (non-sticky) resistance) and electroless tin plating resistance, and excellent adhesion to various substrates, heat resistance, moisture resistance, chemical resistance, electrical insulation and other characteristics of the cured film pattern photocurability · heat Curable resin composition, and its cured product. The present invention also relates to a printed wiring board in which a solder resist layer is formed from a cured product of the composition. Background technique [0002] Today, from the standpoint of high precision and high density, solder resists for some printed circuit boards for civilian use and almost industrial printed circuit boards use solder resists that form an image by deve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/075C08F290/00C08F2/50H05K3/00H05K1/00
Inventor 槙田昇平志村优之
Owner TAIYO INK MFG
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