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Monolithic macro-channel heat sink for semiconductor laser and semiconductor laser

A laser and semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser parts, etc., can solve the problems of no technical solution or inspiration, uneven heat dissipation of laser chips, scrapped laser stacks, etc., and achieve better and uniform heat dissipation effect. , the effect of increased size, reduced risk of clogging

Inactive Publication Date: 2015-07-29
BEIJING HONGGUANG HAOYU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the cylindrical through hole, it forms a longer arc surface on the side close to the chip mounting area in the horizontal direction, which causes the problem of uneven heat dissipation of the laser chip. During the working process of the semiconductor laser, the laser chip will Generate local thermal damage, and then gradually spread to other parts, causing the entire laser stack to be scrapped
For the petal-shaped through hole, its outward diverging boundary makes the through hole form a larger arc surface as a whole, and the above-mentioned problem of uneven heat dissipation is even more serious
The content disclosed in Chinese patent CN 104538836 A is obviously not aware of the above-mentioned technical problems, so there is no relevant technical solution or inspiration for solving the above-mentioned technical problems, and there is no report in other prior art documents

Method used

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  • Monolithic macro-channel heat sink for semiconductor laser and semiconductor laser
  • Monolithic macro-channel heat sink for semiconductor laser and semiconductor laser
  • Monolithic macro-channel heat sink for semiconductor laser and semiconductor laser

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Please refer to figure 1 , 2 , a semiconductor laser monolithic macro-channel heat sink provided by the present invention mainly includes a heat sink body 1, the heat sink body 1 is a sheet structure, and its surface shape is rectangular, on one side of the heat sink body 1 (for For convenience of description, this surface is defined as "upper surface", and the opposite side is "lower surface"). There is a chip mounting area 2 on one end of the heat sink body 1. On both sides of the chip mounting area 2, there are The notch 7 makes the chip mounting area 2 form an outwardly protruding structure relative to other parts of the heat sink body 1. A water cooling area 3 is provided near the chip mounting area 2. Its shape is "racetrack type", and it can also be Rectangular or other shapes, the length of the water cooling area 3 is longer than the length of the chip mounting area 2, so that the heat dissipation area is larger and more uniform. It can also provide working sp...

Embodiment 2

[0039] Such as image 3 , 4 As shown, the difference between the semiconductor laser monolithic macro-channel heat sink provided in this embodiment and Embodiment 1 is that the connection end 42 of the grid hole 4 is linear, that is, it forms a rectangular shape after being combined with two parallel side walls 41 The hole type, its size also can make adaptive adjustment within the scope that gives in embodiment 1. The technical concept of this hole pattern and its arrangement is basically the same as the "racetrack" hole pattern in Embodiment 1, and it also has the characteristics of regular, uniform, end flush and equidistant from the chip mounting area 2. Play an excellent heat dissipation effect. In addition, the shape of the sealing groove 5 is also a rectangle (of course, the raceway shape in Embodiment 1 can also be used).

Embodiment 3

[0041] Please also refer to Figure 5 , this embodiment provides a semiconductor laser that includes a semiconductor laser monolithic macro-channel heat sink in Embodiment 1 or Embodiment 2. The core components in the semiconductor laser include bottom water blocks that are arranged sequentially from bottom to top 11. The lower insulating sheet 12, the positive electrode sheet 13, the semiconductor laser module 14, the negative electrode sheet 15, the upper insulating sheet 16, and the upper water block 17; the semiconductor laser module 14 is formed by stacking a plurality of semiconductor laser units, and the semiconductor laser The module 14 is provided with a liquid cooling channel; the semiconductor laser unit includes a laser chip, a semiconductor laser monolithic macro-channel heat sink, an insulating layer and a negative connection plate, and the semiconductor laser monolithic macro-channel heat sink is Embodiment 1 or embodiment The heat sink in 2, the grid on the hea...

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Abstract

The invention discloses a monolithic macro-channel heat sink for a semiconductor laser. The monolithic macro-channel heat sink comprises a heat sink body, wherein the heat sink body is provided with a chip installation region and a water cooling region; the chip installation region is positioned at one end of the heat sink body; the water cooling region is positioned in the position near the chip installation region; the water cooling region is provided with a grid which penetrates through the heat sink body; the grid is composed of at least two parallelly-arranged grid holes; each grid hole comprises two mutually parallel side walls, and a connecting end for connecting the two side walls. The monolithic macro-channel heat sink has an efficient and uniform heat radiation effect. The invention further correspondingly provides the semiconductor laser with the monolithic macro-channel heat sink.

Description

technical field [0001] The invention relates to the field of semiconductor laser equipment, in particular to a semiconductor laser monolithic macro channel heat sink. The heat sink adopts the grid-shaped water channel to significantly improve the heat dissipation effect of the heat sink, and the invention also provides a semiconductor laser including the heat sink accordingly. Background technique [0002] High-power semiconductor lasers are widely used in solid-state laser pumping, laser processing, laser medical treatment, beauty and other fields. However, when semiconductor lasers are working, about 30% to 50% of the electrical energy will be converted into heat energy loss, and with the increase of power The larger the size, the more stringent the heat dissipation requirements will be. [0003] At present, semiconductor lasers are packaged in the form of overall macro channel and micro channel. [0004] For high-power semiconductor lasers, the overall macro-channel met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
Inventor 崔卫军卢广
Owner BEIJING HONGGUANG HAOYU TECH CO LTD
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