Resin composition, and cured product (1) thereof

A technology of resin composition and cured product, which is applied in the direction of electric solid device, semiconductor/solid state device manufacturing, instruments, etc., can solve problems such as difficulty in obtaining reliability and productivity, increase in cost, decrease in extraction efficiency, etc., and achieve water vapor permeability. The effect of low excess rate, excellent light resistance and low viscosity

Active Publication Date: 2015-07-29
NIPPON KAYAKU CO LTD
View PDF12 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the glass sealing cover is produced by drilling a hole for inserting the desiccant into the flat glass substrate, the cost tends to increase.
In addition, when sealing with a sealing cap, since a desiccant is inserted inside the sealing cap, light cannot be extracted from the sealing cap side.
That is, the extraction of light emitted from the light source from the substrate side of the element is limited to bottom emission type elements
In the case of a bottom emission type element, there are pro...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, and cured product (1) thereof
  • Resin composition, and cured product (1) thereof
  • Resin composition, and cured product (1) thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0245] Next, the present invention will be described in more detail by way of examples. The present invention is not limited to the following examples. In addition, the unit "part" of a numerical value represents a mass part.

[0246] With the compositions shown in the following examples and comparative examples, the respective ultraviolet curable resin compositions and respective cured products of the examples and comparative examples were obtained. In addition, the evaluation method and evaluation standard about a resin composition and a cured film were performed as follows.

[0247] (1) Viscosity: Measured at 25° C. using an E-type viscometer (TV-200: manufactured by Toki Sangyo Co., Ltd.).

[0248] (2) Refractive index of liquid: The refractive index (25 degreeC) of the resin composition mix|blended was measured with the Abbe refractometer (DR-M2; manufactured by Atago Co., Ltd.).

[0249] (3) Water vapor transmission rate: sandwich energy rays or thermosetting resins w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to a resin composition which has a low viscosity (at 25˚C) of not more than 1300mPa·s and a relatively high liquid refractive index of at least 1.50, which is used to seal a surface of an organic electroluminescent (EL) element, and with which a cured product exhibiting excellent visible light transmission, excellent light resistance, a high Tg, and a low water vapour transmission rate can be obtained. The resin composition has a viscosity measured at 25˚C of not more than 1300mPa·s, and includes an aromatic compound (A) and a cyclic compound (B). Aromatic compound (A) has an oxetanyl group or an epoxy group, and has at least one skeleton selected from the group consisting of: a skeleton of biphenyl, bisphenol A, bisphenol F, bisphenol S, or the like represented by formula (A-A) […]; a phenylene skeleton which may be substituted with a C1-4 alkyl group, and which is represented by formula (A-B) […]; an anthracene skeleton; and a phenanthrene skeleton. Cyclic compound (B) has an oxetanyl group or an epoxy group, and satisfies the following conditions (conditions for cyclic compound (B): that the ring in cyclic compound (B) be an aromatic ring, an aliphatic ring, or a heterocycle; in cases when the ring is (a) an aromatic ring, that the cyclic compound have an oxetanyl group or an epoxy group, and an aromatic ring having a structure different to that of the compound used as aromatic compound (A); and, in cases when the ring is (b) an aliphatic ring, that the cyclic compound be either an alicyclic epoxy resin, or, a cyclic compound having an oxetanyl group or an epoxy group, and a cycloalkylene skeleton or an alicyclic hydrocarbon skeleton having a cross-linking structure).

Description

Background technique [0001] Recently, low moisture permeability materials are important materials in various industries. Especially in the electrical, electronic and display peripheral industries, it is an essential material to maintain quality, and a higher-performance low-moisture-permeability material is desired. [0002] In recent years, among displays, a thin display called a flat panel display (FPD), especially a plasma display (PDP) and a liquid crystal display (LCD) have been put into the market and widely used. In addition, an organic electroluminescence (EL) display (OLED) is expected as a next-generation self-luminous thin film display, and has already been put into practical use in some products. An organic EL element of an organic EL display has a structure in which an element part main body including a thin film laminate including a light-emitting layer sandwiched between a cathode and an anode is formed on a substrate such as glass on which a driving circuit su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05B33/04C08G59/20G09F9/30H01L27/32H01L51/50
CPCC08G59/20H01L51/5246C08G65/18H10K59/8722
Inventor 内藤伸彦木户场润松尾雄一朗
Owner NIPPON KAYAKU CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products