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Novel method for reducing chloride ion concentration in acid copper plating solution

A technology of chloride ion concentration and new method, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve problems such as the generation of zinc impurities, achieve fast reaction speed, good effect, and reduce chloride ions.

Inactive Publication Date: 2015-08-26
GUANGZHOU ULTRA UNION CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a new method for reducing the concentration of chloride ions in the acid copper plating solution, and solves the problem that zinc powder is used in the traditional treatment method to produce zinc impurities in the plating solution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: copper powder treatment experiment

[0014] The initial mass concentration of chloride ions in the acid copper plating solution is 174mg / L, add copper powder 1g / L in the plating solution, stir the plating solution, measure the mass concentration of chloride ions with turbidimetry at different times, the obtained results are listed in Table 1. Experiments show that Cu 2+ +Cu+2Cl ― =2CuCl↓ is established, it is effective to use copper powder to treat chloride ions in the acid copper plating solution. In the experiment, it was not found that the plating solution was obviously turbid, indicating that the cuprous chloride generated in the reaction was mainly adsorbed on the surface of the copper powder. With the prolongation of treatment time, the removal rate of chloride ions decreases slightly, the reason is that cuprous chloride is oxidized by a small amount of oxygen molecules in the plating solution to form Cu 2+ Ions (the cuprous chloride and copper p...

Embodiment 2

[0021] Embodiment 2: the removal rate of chloride ion

[0022] Take 5 parts of the acid copper plating solution, which contains 174 mg / L of chloride ions, add different amounts of copper powder, stir the plating solution, react for 10 minutes, and measure the mass concentration of chloride ions in the plating solution. The results are listed in Table 3. Experiments show that with the increase of the amount of copper powder added, the removal rate of chloride ions increases, but the increase is not large. When copper powder 0.5g / L was added to the plating solution, the mass concentration of chloride ions was reduced by 69mg / L. According to the calculation of the reaction equation, 0.062g / L of copper powder participated in the reaction. It can be seen from this that it is necessary to process chloride ions. Add excess copper powder. Adding copper powder 1-2g / L to the plating solution, the removal rate of chloride ions is 63% on average. When copper powder is added to the platin...

Embodiment 3

[0033] When preparing the acid copper plating solution at one time, it may be a problem of the purity of chemical raw materials. After the plating solution is prepared, the mass concentration of chloride ions is 174mg / L, which exceeds the range required by the process.

[0034] Pump the plating solution into the spare tank, use copper powder to treat chloride ions, add copper powder 1g / L, and stir the plating solution vigorously with a stirring bar for 5 minutes (air can also be used to stir the plating solution, but the time should not be too long, otherwise, the Copper will be oxidized by air), then stir the plating solution appropriately, filter the plating solution with a filter after 10-20 minutes, and directly input the filtrate into the original plating tank. Chloride ion was measured after the plating solution was filtered, and its mass concentration was reduced to 75.8mg / L, which met the requirements of the process.

[0035] After adding copper powder to the acid copp...

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Abstract

The invention discloses a novel method for reducing chloride ion concentration in an acid copper plating solution. The method comprises the following steps: adding copper powder in the acid copper plating solution to react for 10-20 min, and filtering to remove a sediment. According to the novel method for reducing the chloride ion concentration in the acid copper plating solution, Cu<2+> ions and chloride ions in the plating solution are simultaneously reacted with copper powder to generate the cuprous chloride sediment, so as to realize the purpose of reducing chloride ions. The method is better in chloride ion treatment effect, and high in reaction rate; through the method, the reaction can be completed within 10 min; the removal rate of the chloride ions is high; zinc impurities cannot be generated in the plating solution; compared with traditional methods, the method has significant advantages.

Description

technical field [0001] The invention relates to a method for treating chloride ions in an acid copper plating solution. Background technique [0002] A small amount of chloride ions must exist in the bright acid copper plating solution to obtain a fully bright coating, and chloride ions can also reduce the internal stress caused by adding brighteners. The mass concentration of chloride ions is generally 20-80 mg / L. When the concentration is too low, the leveling and brightness of the coating will decrease, the internal stress will be large, and dendritic streaks will easily occur. In severe cases, the coating will become rough with pinholes, or even burned Coke, the concentration is too high, the coating is not bright enough, and the coating is foggy in the low current density area. When the concentration of chloride ions in the bath is too high, the zinc powder treatment method is mainly used at present. Silver carbonate or silver sulfate treatment can also be used, but t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D21/14
Inventor 郭崇武赖奂汶
Owner GUANGZHOU ULTRA UNION CHEM LTD
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