Tackifier for LED packaging adhesive and preparation method of tackifier

A technology of LED encapsulation and tackifier, used in adhesives, electrical components, circuits, etc., can solve problems such as Pt catalyst poisoning, and achieve the effects of mild reaction conditions, good compatibility and simple process

Inactive Publication Date: 2015-09-02
SHENZHEN CAPCHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when this tackifier is used in LED silicon

Method used

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  • Tackifier for LED packaging adhesive and preparation method of tackifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] With 210 parts by weight of diphenylsilanediol (Green Chemical Industry Co., Ltd., Xiantao City), 130 parts by weight of γ-glycidyl ether oxypropyltriethoxysilane (Bailingwei Technology Co., Ltd.), 120 parts by weight of γ-methacryloxypropyltrimethoxysilane (Hangzhou Dadi Chemical Co., Ltd.) was added to the reactor. Then add 2 parts by weight of Ba(OH) 2 2H 2 O is used as a catalyst, and the temperature is raised to 80°C for non-hydrolytic condensation reaction. After 3 hours of reaction, further condensation reaction is carried out under vacuum for 0.5 hours. Stop the vacuum, lower the temperature, discharge, and centrifuge to remove the catalyst base to obtain a light yellow or colorless tackifier.

Embodiment 2

[0038] With 250 parts by weight of diphenylsilanediol (Great Chemical Industry Co., Ltd., Xiantao City), 100 parts by weight of β-(3,4-epoxycyclohexyl) ethyl trimethoxysilane (Hangzhou Yiyuan Chemical Industry Co., Ltd. company), 100 parts by weight of γ-methacryloxypropyl triethoxysilane (Bailingwei Technology Co., Ltd.) was added to the reactor. Then add 0.5 parts by weight of Ba(OH) 2 2H 2 O is used as a catalyst, and the temperature is raised to 60°C for non-hydrolytic condensation reaction. After 5 hours of reaction, further condensation reaction is carried out under vacuum conditions for 2 hours. It is advisable to control the degree of vacuum so that the feed liquid does not foam. Stop the vacuum, lower the temperature, discharge, and centrifuge to remove the catalyst base to obtain a light yellow or colorless tackifier.

Embodiment 3

[0040] With 230 parts by weight of diphenylsilanediol (Green Chemical Industry Co., Ltd., Xiantao City), 120 parts by weight of γ-glycidyl ether oxypropyltriethoxysilane (Bailingwei Technology Co., Ltd.), 110 parts by weight of γ-Methacryloxypropyltriethoxysilane (Bailingwei Technology Co., Ltd.) was added to the reactor. Then add 1 weight part of NaOH as a catalyst, heat up to 100° C. for non-hydrolytic condensation reaction, and react for 4 hours, then further condense for 1 hour under vacuum conditions. Stop the vacuum, lower the temperature, discharge, and centrifuge to remove the catalyst base to obtain a light yellow or colorless tackifier.

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Abstract

The invention discloses a tackifier for an LED packaging adhesive and a preparation method of the tackifier. The tackifier is faint yellow or colorless, and obtained by virtue of the following steps: performing a non-hydrolytic condensation reaction on diphenyl silanediol, siloxane with an epoxy group and siloxane with an acryloyloxy group under the catalysis of alkali, and then performing a further condensation reaction under the vacuum condition. After the tackifier is added to an organic silicon LED packaging material, the tackifier is capable of remarkably improving the adhesive properties of the cured organic silicon LED packaging material with a plurality of substrates such as PPA, silver, aluminum, copper and stainless steel; the tackifier has excellent compatibility with the organic silicon LED packaging material; the tackifier has extraordinarily good intersolubility with a double-component added silicon resin without color changing phenomenon and any peculiar smell; the method for preparing the tackifier is easily available in raw materials, mild in reaction conditions, simple in process, high in operability, and prone to industrial production.

Description

technical field [0001] The invention relates to the technical field of LED packaging adhesives, in particular to a tackifier for LED packaging adhesives and a preparation method thereof. Background technique [0002] Due to the characteristics of high refractive index, high light transmittance, and thermal shock resistance, organic silicon LED (light-emitting diode) packaging materials can well solve many technical problems existing in traditional epoxy resin packaging materials. The development of green and environmentally friendly LED lighting technology has achieved rapid development, and its application is becoming more and more extensive. Addition-type liquid silicone rubber cures vinyl-containing siloxane and hydrogen-containing siloxane through a hydrosilylation reaction to obtain a silicone LED packaging material, which has no by-products in the vulcanization process, low shrinkage, and deep energy. With the advantages of hierarchical curing, it has been rapidly dev...

Claims

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Application Information

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IPC IPC(8): C08G77/20C08G77/18C08G77/06C09J183/06C09J183/07H01L33/56
Inventor 赵大成吴艳马子淇汪雄伟
Owner SHENZHEN CAPCHEM TECH
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