Nickel, tungsten and graphene composite plating solution, plated film and making method of plated film

Abstract

The invention discloses a nickel, tungsten and graphene composite plating solution, a plated film and a making method of the plated film. GE with good mechanical performances and effective dispersion property is introduced into the plating solution, and the GE is effectively deposited and dispersed in a Ni-W matrix in the electroplating process. The Ni-W-GE composite plated film is successfully made on a carbon steel matrix through a pulse plating codeposition technology. Graphene is dispersed in the Ni-W matrix, and the structure of the plated film is improved by effectively changing the competition relation between crystal nucleation and growth in the codeposition process in order to make a deposited film layer uniform and compact, so the intercrystalline corrosion is weakened, the diffusion path of a corrosion medium is prolonged, the self-corrosion potential is improved, local corrosion is effectively inhibited, and the stability of a passive film is improved, thereby the corrosion resistance of the composite plated film is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a nickel-tungsten-graphene composite plating solution, a coating film and a preparation method thereof. Background technique [0002] At present, the method for preparing Ni-W coating is mainly the traditional Ni-W coating electroplating process, and the main plating solution composition and process parameters are shown in Table 1: [0003] Table 1 [0004] [0005] The Ni-W coating preparation process is: sanding → ultrasonic cleaning → degreasing → ultrasonic cleaning → pickling activation → pulse plating → cleaning → post-processing → finished product. [0006] When the traditional electroplating process is used to prepare Ni-W coatings, the current efficiency is low, the hydrogen evolution is serious, and the electrochemical active sites are few, which leads to the residual internal stress of the coating formed during the deposition process, coarse crystal grains, ...

AI Technical Summary

Problems solved by technology

[0006] When the traditional electroplating process is used to prepare Ni-W coatings, the current efficiency is low, the hydrogen evolution is serious, and the electrochemical active sites are few, which leads to the residual internal stress of the coating formed during the deposition process, the crystal grains are coa...

Images