Heating plate and soldering method of IGBT (insulated gate bipolar transistor) module

Abstract

The invention discloses a heating plate for soldering of an IGBT (insulated gate bipolar transistor) module and a soldering method of the IGBT module. The heating plate is designed to adopt a heating column structure, during soldering, the back of a bottom plate is completely laminated with the base and / or the upper surface of the heating column of the heating plate under the effect of gravity, the heating plate can be adapted to different pre-bending shapes of bottom plates, fully lamination of the heating plate with the arc-shaped bottom plate of the IGBT module in the reflow soldering process is guaranteed, the contact area of the heating plate and the bottom plate of the IGBT module is increased, the uniformity of the temperature of the bottom plate of the IGBT module in the soldering process is guaranteed, the soldering void ratio is decreased, and the reliability of the IGBT module is improved.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a heating plate used for welding IGBT modules and a welding method for IGBT modules. Background technique [0002] The IGBT module (Insulated Gate Bipolar Transistor, translated into insulated gate bipolar transistor in Chinese) is a device composed of a MOSFET and a bipolar transistor. The device combines a high-power transistor (GTR) and a high-power field effect The advantage of the transistor (MOSFET) is that it is an ideal full-control device, which has the advantages of convenient control, fast switching speed, high operating frequency, and large safe working area. At present, the capacity of commercialized high-power IGBT modules has reached 750A / 6500V, which can meet the application requirements in the field of power electronics and power transmission. [0003] During the packaging process of high-power IGBT modules, due to the large difference in thermal expansion co...

AI Technical Summary

Problems solved by technology

[0006] (1) As the soldering temperature increases, the decomposition of the flux in the solder is accelerated, the viscosity of the solder increases, and the residue of the flux is not easy to remove, which may increase the void rate;

[0007] (2) If the welding temperature is too high, the oxidation rate of the welding parts will increase, and at the same time, it may cause damage to the chip and reduce the reliability of the module;

[0009] (4) Extending the welding time and raising the welding temperature reduces the welding efficiency and wastes energy

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