A waste gas treatment device

Abstract

The invention discloses a waste gas treatment device. The waste gas treatment device comprises a combustion chamber, a first settling basin, a first spray pipe, a second settling basin and a second spray pipe. The combustion chamber is sequentially provided with a heat insulation layer, an adhesive layer and a mill finish layer from outside to inside. The first settling basin is arranged below the combustion chamber. The first spray pipe is connected with the combustion chamber and the first settling basin, and is a hollow cylinder. Containing space is arranged between the inner wall and the outer wall of the first spray pipe. Three layers of round through holes are formed in the inner wall of the first spray pipe in the circumferential direction at intervals. A water inlet hole connected with a control valve is formed in the outer wall of the first spray pipe. The second settling basin is communicated with the first settling basin. One end of the second spray pipe is communicated with the second settling basin, and the other end of the second spray pipe is communicated with the atmosphere. The spray pipes are provided with interlayers, and by means of the round through holes, the contact face of liquid and gas is increased, and the treatment capacity of liquid washing to waste gas is improved. Due to an inner wall cleaning device, the service life of a main shaft is prolonged, and the inner wall of the combustion chamber can be treated by combining the scaling degree of the inner wall.

Description

technical field

[0001] The invention relates to an exhaust gas treatment device. More particularly, the present invention relates to an exhaust gas treatment device for treating exhaust gas generated in a semiconductor manufacturing process. Background technique

[0002] In the semiconductor manufacturing process, a variety of special gases and a large amount of acid or alkali are used, and a large amount of waste gas is used in different processes of semiconductor manufacturing. These waste gases are collected and treated through the exhaust system to prevent direct discharge to the environment and people. serious health consequences.

[0003] The exhaust gas generated in the semiconductor manufacturing process generally adopts methods such as water washing, combustion, adsorption, and dissociation. However, the method of burning and washing to remove exhaust gas can effectively treat the main waste PFCs in the exhaust gas, and can handle large flow of exhaust gas. At the ...

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