Synthetic process for manufacturing composite material with pressure sensitive characteristic

Abstract

The invention discloses a synthetic process for manufacturing a composite material with a pressure sensitive characteristic. The synthetic process comprises uniformly blending a metal nano material, a semiconductor ceramic nano material and a macromolecular matrix material to prepare a homogeneous macromolecular nano composite material. The homogeneous macromolecular nano composite material comprises the following components in parts by weight: 30-50 parts of the metal nano material, 15-40 parts of the semiconductor ceramic nano material and 55-85 parts of macromolecular matrix material. As the composite material with the pressure sensitive characteristic is prepared by adopting the process method, the composite material can be used for manufacturing pressure sensitive elements with characteristics of high performance and high precision.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular, it relates to a synthesis process for making a composite material with hyposensitivity properties. Background technique [0002] With the development of science and technology, people have developed new materials on the basis of traditional materials and according to the research results of modern science and technology. New materials are divided into four categories according to their components: metallic materials, inorganic non-metallic materials (such as ceramics, gallium arsenide semiconductors, etc.), organic polymer materials, and advanced composite materials. According to material properties, it can be divided into structural materials and functional materials. Structural materials mainly use the mechanical and physical and chemical properties of materials to meet performance requirements such as high strength, high stiffness, high hardness, high temperature resi...

AI Technical Summary

Problems solved by technology

[0003] At present, there are mainly three types of components used for overvoltage protection of electronic circuits: ceramic varistors, silicon-based semiconductor transient overvoltage protection components and polymer ESD protection components: ceramic varistors are doped with ceramics, at high temperatures Bottom sintering semiconducting, made of roasted electrodes at both ends, its main disadvantages are high energy consumption, short life, less impact resistance, and poor pressure-sensitive characteristics; silicon-based semiconductor transient overvoltage protection components use semiconductor Its main features are large product investment, high production cost, large environmental pollution, and high additional capacitance of the product; polymer ESD protection components are made of polymer materials and conductive particles to form a material with pressure-sensitive properties , the pressure-sensitive properties of the material are not good, and the repeatability is very poor