Addition agent and process for producing 6-micron low-warping-degree electrolytic copper foil through addition agent

A technology of additives and electrolytes, applied in electrolysis process, electroforming, etc., can solve problems affecting the cutting of splitters, affecting the quality of copper clad laminates, affecting the bonding of substrates, etc., and achieves increased technical added value, low warpage, Solve the effect of large warpage

Inactive Publication Date: 2015-10-28
LINGBAO WASON COPPER FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, copper foil warping affects the cutting of the splitting machine row, on the other hand, it is easy to cause wrinkles and air bubbles in the electrolytic copper foil, which affects the adhesion with the substrate, and then affects the quality of the copper clad laminate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of additive, this additive is to contain brightener SPS, macrogol 6000, thiourea and Cl - aqueous solution, and the concentration of SPS in the additive is 11g / l, the concentration of polyethylene glycol 6000 is 13g / l, the concentration of thiourea is 9g / l, Cl - The concentration is 22ppm.

[0019] A process for producing 6 μm low-warpage electrolytic copper foil using the additive described in claim 1, comprising the steps of:

[0020] 1) Solution preparation: dissolve the raw material copper rod in sulfuric acid solution to generate copper sulfate electrolyte, adjust the copper ion content in the copper sulfate electrolyte to 80g / L, H 2 SO 4 The concentration is 90g / L, the chloride ion content is 20ppm, and the temperature is 46°C;

[0021] 2) Electrolytic foil production: filter the copper sulfate electrolyte obtained in step 1) and send it to the clean liquid tank, add the above-mentioned additives in the clean liquid tank, and then send the copper sulfate...

Embodiment 2

[0024] A kind of additive, this additive is to contain brightener SPS, macrogol 6000, thiourea and Cl - aqueous solution, and the concentration of SPS in the additive is 15g / l, the concentration of polyethylene glycol 6000 is 5g / l, the concentration of thiourea is 12g / l, Cl - The concentration is 24ppm.

[0025] A process for producing 6 μm low-warpage electrolytic copper foil using the additive described in claim 1, comprising the steps of:

[0026] 1) Solution preparation: dissolve the raw material copper rod in sulfuric acid solution to generate copper sulfate electrolyte, adjust the copper ion content in the copper sulfate electrolyte to 75g / L, H 2 SO 4 The concentration is 85g / L, the chloride ion content is 19ppm, and the temperature is 50°C;

[0027] 2) Electrolytic foil production: filter the copper sulfate electrolyte obtained in step 1) and send it to the clean liquid tank, add the above-mentioned additives in the clean liquid tank, and then send the copper sulfate...

Embodiment 3

[0030] A kind of additive, this additive is to contain brightener SPS, macrogol 6000, thiourea and Cl - aqueous solution, and the concentration of SPS in the additive is 8g / l, the concentration of polyethylene glycol 6000 is 6g / l, the concentration of thiourea is 7g / l, Cl - The concentration is 20ppm.

[0031] A process for producing 6 μm low-warpage electrolytic copper foil using the additive described in claim 1, comprising the steps of:

[0032] 1) Solution preparation: dissolve the raw material copper rod in sulfuric acid solution to generate copper sulfate electrolyte, adjust the copper ion content in the copper sulfate electrolyte to 85g / L, H 2 SO 4 The concentration is 95g / L, the chloride ion content is 23ppm, and the temperature is 48°C;

[0033] 2) Electrolytic foil production: filter the copper sulfate electrolyte obtained in step 1) and send it to the clean liquid tank, add the above-mentioned additives in the clean liquid tank, and then send the copper sulfate e...

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PUM

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Abstract

The invention provides an addition agent and a process for producing 6-micron low-warping-degree electrolytic copper foil through the addition agent, belongs to the technical field of electrolytic copper foil and particularly relates to addition agents. The addition agent is a water solution containing brightener SPS, polyglycol, thiourea and Cl-, wherein in the addition agent, the concentration of the SPS ranges from 6 g / l to 17 g / l; the concentration of the polyglycol ranges from 2 g / l to 15 g / l; the concentration of the thiourea ranges from 4 g / l to 15 g / l; the concentration of the Cl- ranges from 15 ppm to 25 ppm. The invention further discloses the process for producing the low-warping-degree electrolytic copper foil through the addition agent. The warping height of the 6-micron electrolytic copper foil produced through the addition agent and the process is smaller than or equal to 12 mm, the problem that the warping degree of existing 6-micron electrolytic copper foil is large is effectively solved, and the technical additional value is remarkably increased.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil, and in particular relates to an additive and a process for producing 6 μm low warpage electrolytic copper foil using the additive. Background technique [0002] At present, with the further upgrading of the new energy industry, 6μm lithium battery copper foil has a broader market prospect. However, warpage is a major problem often encountered in the production process of ultra-thin electrolytic electrolytic copper foil, and it is generally caused by the production process. On the one hand, copper foil warping affects the cutting of the splitting machine row, on the other hand, it is easy to cause wrinkles and air bubbles in the electrolytic copper foil, which affects the bonding with the substrate, and then affects the quality of the copper clad laminate. Therefore, it is imminent to develop a production process to reduce the warpage of 6 μm electrolytic copper foil. Contents ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04
Inventor 樊斌锋王建智韩树华张欣何铁帅
Owner LINGBAO WASON COPPER FOIL
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