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Adhesive sheet and method for producing processed device-related parts

A technology related to equipment and components, applied in the direction of non-polymer adhesive additives, semiconductor/solid-state device manufacturing, adhesive additives, etc. Problems such as resistance, to achieve the effect of reducing adhesion, manufacturing productivity, and suppressing outgassing

Active Publication Date: 2017-07-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] On the other hand, the polymer having such a polymerizable functional group, since the mobility of the polymerizable functional group is restricted, in the inclusion-type adhesive composition, relative to the blend-type adhesive composition, When irradiated with energy rays, the polymerization reaction is difficult to proceed inside, and as a result, the adhesive layer sometimes tends to be difficult to cure
In the case of using a light source that generates less heat in the object to be irradiated, such as an ultraviolet LED, the mobility of the polymerizable functional group of the polymer becomes relatively lower, and as a result, the adhesive layer becomes more Difficult to cure, prone to failure to fully achieve the purpose of reducing adhesion due to energy ray curing

Method used

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  • Adhesive sheet and method for producing processed device-related parts
  • Adhesive sheet and method for producing processed device-related parts
  • Adhesive sheet and method for producing processed device-related parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] (1) Preparation of coating composition

[0116] A solution-state coating composition (solvent: toluene) having the following composition was prepared.

[0117] i) As a polymer (A) having a polymerizable functional group, a copolymer obtained by copolymerizing 52 parts by mass of butyl acrylate, 20 parts by mass of methyl methacrylate, and 28 parts by mass of hydroxyethyl acrylate (weight-average molecular weight: 600,000, glass transition temperature Tg: -34°C), a combination of 2-methacryloyloxyethyl isocyanate in an amount corresponding to 80 mol% of the hydroxyl groups contained in the copolymer (manufactured by Showa Denko, KARENZ MOI) was reacted, and the obtained polymer was calculated as 100 parts by mass,

[0118] ii) As the photopolymerization initiator (B), a composition containing 2,2-dimethoxy-1,2-diphenylethan-1-one (manufactured by BASF, IRGACURE 651, at 3% by mass The mass absorption coefficient of wavelength 365nm under the state of methanol solution: ...

Embodiment 2～3 and comparative example 1～6

[0124] In Example 1, either one or both of the kind and the added amount of the photopolymerizable compound (B) were changed as shown in Table 1, and a pressure-sensitive adhesive sheet was obtained.

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PUM

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Abstract

A kind of adhesive sheet 1, it has base material 2 and the adhesive layer 3 that is provided on one main surface side of base material 2, adhesive layer 3 is formed by adhesive composition, and this adhesive composition Containing a polymer (A) having a polymerizable functional group and a photopolymerization initiator (B) of 2 parts by mass or less with respect to 100 parts by mass of the polymer (A) having a polymerizable functional group, the photopolymerization initiator (B) ) of a 3 mass % methanol solution at a wavelength of 365 nm (unit: ml / g·cm) is 200 or more and 1000 or less. In this PSA sheet 1, the PSA layer 3 is formed of an PSA composition containing a polymer (A) having a polymerizable functional group, can be cured by irradiation with a small amount of heat, and can sufficiently reduce the risk for processing. Adhesion to post-equipment-related parts, and excellent storage stability while suppressing outgassing.

Description

technical field [0001] The present invention relates to an adhesive sheet used for grinding or dicing the back surface of device-related parts such as semiconductor packages formed by resin-encapsulating a semiconductor wafer or a plurality of semiconductor wafers, and processed device-related parts using the adhesive sheet manufacturing method. In addition, the "cut sheet" in the present invention also includes a part of "cut" patch (Die Bonding). In addition, the "adhesive sheet" also includes an adhesive sheet having another base film and an adhesive layer for bonding a wafer ring frame. In addition, the concept of "adhesive tape" is also included in the "sheet" in this invention. Background technique [0002] Forming sheet-like parts formed by individualizing device-related parts or adjusting the thickness of device-related parts by performing processing on device-related parts such as semiconductor wafers and semiconductor packages, especially mechanical processing su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C09J11/06C09J201/02H01L21/301H01L21/304
CPCC08K5/0025C09J2203/326C09J2423/04C09J2433/00C09J7/385C09J2301/122C09J2301/416C09J2301/408
Inventor 宫永朋治佐藤明德斋藤阳介
Owner LINTEC CORP
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