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Method for preparing multilayer ceramic capacitor

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, etc., can solve the problems of increasing dust on the production site, unfavorable environmental protection and sanitation

Active Publication Date: 2015-11-11
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] For the above-mentioned sintering consistency problem, this field usually adopts buried powder sintering method to solve, but buried powder sintering method will increase the dust degree of the production site, which is not conducive to environmental protection and sanitation

Method used

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  • Method for preparing multilayer ceramic capacitor

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Embodiment Construction

[0026] The preparation method of the multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings.

[0027] combine figure 1 and figure 2 , the preparation method of the multilayer ceramic capacitor of an embodiment, comprises the steps:

[0028] S10, uniformly mixing the ceramic powder doped with the sintering aid, the binder, and the organic solvent to obtain a ceramic slurry, and then preparing a ceramic thin film by using the ceramic slurry as a raw material.

[0029] In this embodiment, the operation of uniformly mixing the ceramic powder doped with sintering aid, the binder, and the organic solvent is as follows: the ceramic powder doped with the sintering aid, the adhesive, and the organic solvent are uniformly mixed by ball milling , The ball milling time can be 10h ~ 16h.

[0030] In the ceramic slurry, the mass ratio of the ceramic powder doped with the sintering aid, the binder and the organic solven...

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Abstract

The invention discloses a method for preparing a multilayer ceramic capacitor (MLCC). The method comprises the following steps of: preparing a ceramic film; preparing a ceramic film on which an inner electrode pattern is printed; laminating multiple ceramic films on which inner electrode patterns are printed so as to obtain a lamination unit, laminating multiple ceramic films on the two opposite side surfaces of the lamination unit to obtain a first substrate; press fitting and then cutting the first substrate to obtain a laminate; laminating and then pressing fitting the multiple ceramic films to obtain a second substrate; placing the laminate on the second substrate, placing the second substrate provided with the stacked body on a load bearing board in order to bond and sinter the laminate, thereby obtaining a ceramic body; chamfering the ceramic body and then adhering two outer electrodes so as to obtain the MLCC. According to the method for preparing the MLCC, when sintering is performed, a sintering aid in the second substrate volatilizes so as to form a local atmosphere with high concentration around the stacked body. Thus, the sintered ceramic body is uniform and compact, and good in consistency.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a preparation method of a multilayer ceramic capacitor. Background technique [0002] Copper inner electrode multilayer ceramic capacitors use copper with high conductivity as the inner electrode material, which has extremely low equivalent series resistance and is suitable for high frequency applications. In the preparation process of copper inner electrode multilayer ceramic capacitors, the sintering temperature of the ceramic dielectric material co-fired with the copper inner electrode cannot be higher than the melting point of copper, 1083 ° C, so generally more sintering aids are added than other ceramic materials. So that the ceramic dielectric material co-fired with the copper inner electrode can be sintered densely at a temperature lower than the melting point of copper. However, since the sintering aids tend to volatilize easily during high-temperature sintering, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30
Inventor 陆亨廖庆文祝忠勇
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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