Packaging structure and packaging method of micro-electromechanical system (MEMS) sensor

Abstract

The invention provides a packaging structure and a packaging method of a micro-electromechanical system (MEMS) sensor. The packaging structure comprises a silicon nitride ceramic base, an internal bonding pad, an external bonding pad, an internal circuit and a metal cover, wherein the silicon nitride ceramic base is used for fixing an MEMS sensor chip; the internal bonding pad is located on the upper surface of the silicon nitride ceramic base and is connected with a signal output end of the MEMS sensor chip; the external bonding pad is located on the lower surface of the silicon nitride ceramic base; the internal circuit is connected with the internal bonding pad and the external bonding pad; and the metal cover is fixed on the upper surface of the silicon nitride ceramic base. According to the packaging structure and the packaging method, the effects on the device performance of the MEMS sensor due to package thermal stress are effectively reduced, so as to improve the whole performance of the sensor.

Description

technical field [0001] The present application relates to the technical field of component packaging, and in particular to a packaging structure and packaging method of a MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) sensor. Background technique [0002] MEMS (micro-mechanical system) is an emerging technology developed on the basis of traditional integrated circuit technology. It realizes sensing or executive functions by fabricating micron-scale mechanical structures. Due to the large difference between its size and the conventional functional modules of millimeters or centimeters, it is necessary to realize the mutual transmission of electrical signals between modules of different scales through packaging. It is possible to reduce the impact on the MEMS chip, and at the same time protect the MEMS chip from the influence of external environmental disturbance factors. [0003] The packaging of traditional MEMS sensor chips mainly includes three me...

AI Technical Summary

Problems solved by technology

Most of the current mainstream MEMS sensor chips are made of silicon materials, while the ceramics used in traditional ceramic packaging methods are mostly alumina and aluminum nitride. The thermal expansion coefficient of this material and the material (silicon) of MEMS sensor chips is quite different. , when the temperature of the packaged or packaged device changes, different materials shrink or expand in different degrees, and the resulting stress mismatch will cause deformation of the package shell of the MEMS sensor chip and the MEMS chip itself, thereby affecting the MEMS sensor chip. The performance of the sensor chip device, or even directly lead to the failure of the MEMS sensor chip device

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