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A processing method for a lead terminal of a power semiconductor module

A technology of power semiconductors and lead terminals, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as difficult mass production and complicated processing technology, and achieve good welding effect and simple processing technology , The effect of reliability improvement

Active Publication Date: 2017-12-01
YANGZHOU HY TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the use of tin plating after injection molding, the processing technology is very complicated and it is difficult to mass produce

Method used

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  • A processing method for a lead terminal of a power semiconductor module
  • A processing method for a lead terminal of a power semiconductor module
  • A processing method for a lead terminal of a power semiconductor module

Examples

Experimental program
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Effect test

Embodiment 1

[0041] A method for processing lead terminals of a power semiconductor module, comprising the steps of:

[0042] Step 1. Use strip-shaped thin copper bars as raw materials for processing the lead terminals of power semiconductor modules, and clean the copper bars in sequence with deionized water and absolute ethanol to remove grease and dust on the surface of the copper bars;

[0043] Step 2, compound a layer of aluminum row along the length direction at the lower end of the copper row; the composite method is a conventional method in the art

[0044] Step 3: Stamp and form the lead terminal pins of the power semiconductor module on the upper end of the copper bar by means of local stamping;

[0045] Step 4, tinning the stamped and formed power semiconductor module lead terminal pins; tinning can be chemical tinning or electrolytic tinning, or other conventional methods in the field;

[0046] Step 5. Completely punch the lead terminals of the power semiconductor module to ens...

Embodiment 2

[0049] A method for processing lead terminals of a power semiconductor module, comprising the steps of:

[0050] Step 1. Use strip-shaped thin copper bars as raw materials for processing the lead terminals of power semiconductor modules, and clean the copper bars in sequence with deionized water and absolute ethanol to remove grease and dust on the surface of the copper bars;

[0051] Step 2, nickel-plating the copper bar as a whole; the nickel-plating method is a conventional method in the art, such as electroless nickel plating or electroplating nickel;

[0052] Step 3: Stamp and form the lead terminal pins of the power semiconductor module on the upper end of the copper bar by means of local stamping;

[0053] Step 4, tinning the stamped and formed power semiconductor module lead terminal pins; tinning can be chemical tinning or electrolytic tinning, or other conventional methods in the field;

[0054] Step 5. Complete stamping of the lead terminals of the power semiconducto...

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PUM

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Abstract

The invention provides a method for processing lead terminals of power semiconductor modules. The invention uses copper-clad aluminum bars or nickel-plated copper bars as processing raw materials, and uses local stamping to form lead terminal pins of power semiconductor modules; then the stamped and formed power semiconductor The module lead terminal pins are tin-plated; then the power semiconductor module lead terminals are completely stamped; finally, the power semiconductor module lead terminals are embedded and injected into the insulating shell of the power semiconductor module. Compared with the conventional process, the processing method of the lead terminal of the power semiconductor module of the present invention has the following advantages: the copper-clad aluminum terminal is used, and the bonding effect is very good; the secondary stamping step is added, and the process of first partial stamping, tinning and then stamping is adopted. , the welding effect is very good; the reliability of the module is improved, and the process is fully compatible; and the tinning is first followed by injection molding, the processing technology is very simple, suitable for mass production.

Description

technical field [0001] The invention belongs to the technical field of power semiconductor modules, and in particular relates to a processing method for lead terminals of power semiconductor modules. Background technique [0002] In the existing power semiconductor module structure, the lead wires on the casing serve a function of connecting the internal circuit with the external circuit. The lead terminal and the internal connection method are aluminum wire bonding, and the external connection method is welding, so there are special requirements for the material of the lead terminal. Mainly include: 1. The connection strength between the bonding surface and the aluminum wire must be very strong; 2. The flow capacity of the lead terminal; 3. The connection between the lead terminal and the outside must be well welded. At present, the methods commonly used in the world are: 1. The pure copper terminal with nickel plating on the surface is characterized by general bonding eff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/48
Inventor 贺东晓尹建维
Owner YANGZHOU HY TECH DEV