Indium interconnection mechanism and its preparation method, focal plane device and its packaging method

Abstract

The invention discloses an indium interconnection mechanism used for the packaging of focal plane devices, comprising an insulating substrate, a plurality of through holes are arranged on the insulating substrate, a metal layer is arranged on the wall of the through holes, and the The through hole is filled with an indium column, and the indium column extends out from both ends of the through hole, and solder balls are respectively formed at the two ends of the indium column. The invention also discloses a preparation method of the above-mentioned indium interconnection mechanism. The present invention also discloses a focal plane device and a packaging method thereof. The focal plane device includes a focal plane device and a readout circuit, and also includes the aforementioned indium interconnection mechanism; the focal plane device and the readout circuit pass The indium interconnects are connected. The invention improves the yield rate and connection quality of the focal plane device connection, and greatly reduces the production cost of the device; moreover, the indium interconnection mechanism has a simple structure and a simple and convenient preparation process, and is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to an indium interconnection mechanism used for focal plane device packaging and a preparation method thereof, as well as a focal plane device and a packaging method thereof. Background technique [0002] At present, focal plane devices are widely used in the research and development of various optoelectronic devices, especially focal plane infrared detectors. The infrared focal plane device is a key component of the infrared system and thermal imaging device. It is placed on the focal plane of the infrared optical system, so that each pixel of the scene in the entire field of view corresponds to a sensitive element. , has been widely used in the military field, and has huge market potential and application prospects. The photosensitive element array is arranged on the focal plane of the focal plane detector. The infrared rays emitted from infinity are imaged on t...

AI Technical Summary

Problems solved by technology

This kind of interconnection requires that the prepared indium pillars have high uniformity in height. According to reports, the height uniformity of indium pillars prepared by evaporation and stripping is higher than that of electroplating. The peeling yield is low, so if you want to achieve smaller pixels and higher density focal plane indium column interconnections, you can use electroplating

At the same time, the preparation process of the device, especially the readout circuit, is complicated and the cost is extremely high. The preparation of the indium column in the conventional process is carried out after the completion of the focal plane device and the readout circuit process. Once the preparation of the indium column fails, the focal plane device and the readout The circuit will be scrapped, increasing the cost of the device

Images