Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method

Abstract

The invention relates to a self-aligning sintering clamp of a semiconductor laser tube core and a tube core sintering method. The self-aligning sintering clamp comprises a bracket, an alignment base, a compression column and a spring, wherein the bracket is provided with a bottom support seat and a cantilever; a positioning clamping groove matched with the alignment base is formed in the bottom support seat; a compression column guide hole is formed in the cantilever; the spring sleeves the upper part of the compression column; a heat sink carrying table is arranged on the alignment base; and the tube core on the heat sink can be rightly aligned at the lower end of the compression column when the alignment base is completely pushed into the positioning clamping groove, so that the compression column can be pressed on the tube core under the elasticity of the spring. The invention further provides a method for sintering the semiconductor laser tube core by the clamp. The clamp provided by the invention is simple in structure; self-aligning can be realized; the overall clamp can be conveniently arranged in a nitrogen protective casing; oxidation of solder is effectively prevented during high-temperature sintering; and fast and massive sintering of the tube core and the heat sink of the semiconductor laser is realized.

Description

technical field [0001] The invention relates to a self-aligning sintering jig for semiconductor laser tube cores and a using method thereof, belonging to the technical field of semiconductor laser tube core sintering. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high electro-optical conversion efficiency, long life and high reliability, and are gradually replacing the traditional gas and solid-state lasers in the application market. The application gradually expands. When the semiconductor laser is working, the waste heat generated by the die needs to be discharged in time, otherwise it will cause the device to overheat and cause the laser to fail. Therefore, the widely used technical solution is to sinter the semiconductor laser die onto a heat sink with strong heat dissipation capability, and effectively evacuate the heat generated by the die through the heat sink. The connection between the heat sink and the die nee...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the heat sink needs to be accurately placed in the corresponding position of the base fixing groove under the microscope to ensure that it is facing the pressure pin; and the core is pressed by the gravity of the pressure pin. In the furnace and during high-temperature sintering, the pressure pin may be displaced due to vibration and melting of the solder, causing the die to shift, reducing the sintering pass rate and the reliability of the laser

The disadvantage of this method is that it is necessary to place heat sinks, tube cores and drop pressing pins under the microscope, which is inconvenient to use and low in efficiency; and there are many parts in the whole device, it is difficult to process and assemble the precision parts required, and the manufacturing cost High, not suitable for batch sintering

The fixture needs to position and place the laser packaged on the sub-heat sink under the observation of a microscope. Due to the lack of corresponding positioning devices, self-alignment cannot be achieved, and the operation is inconvenient; It is inclined to the bottom surface, which may cause the sliding displacement of the laser die when touching the laser, which will cause the sintered laser to shift, reducing the sintering yield and spot quality

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