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Flexible composite aluminum substrate and preparation method thereof

A composite aluminum, flexible technology, applied in the direction of circuit substrate materials, chemical instruments and methods, printed circuit manufacturing, etc., can solve the problems that flexible circuit boards are less involved in information storage, no one thinks about information capacity, etc., and achieve simple preparation methods, The effect of improving the utilization rate

Active Publication Date: 2015-11-25
DONGGUAN YILIAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, at present, flexible circuit boards are less involved in information storage, and no one has thought of using them to increase information capacity, and small volume and large capacity are the current development direction of electronic products.

Method used

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  • Flexible composite aluminum substrate and preparation method thereof

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Effect test

Embodiment 1

[0020] Embodiment 1: as figure 1 as shown,

[0021] A flexible composite aluminum substrate, including sequentially connecting a copper foil conductive layer 1, a first flexible thermally conductive adhesive layer 2, an insulating layer 3, a second flexible thermally conductive adhesive layer 4, and a flexible heat-dissipating aluminum foil 5, the insulating layer 3 and the first flexible A first silver bromide photosensitive layer 6 is arranged between the thermally conductive adhesive layers 2, a second silver bromide photosensitive layer 7 is arranged between the insulating layer 3 and the second flexible thermally conductive adhesive layer 4, and the first silver bromide photosensitive layer The total area of ​​6 and the second silver bromide photosensitive layer 7 is 1 / 3 of the insulating layer 3 .

[0022] The thickness of the first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 1 μm.

[0023] The insulating layer 3 is a ...

Embodiment 2

[0028] A flexible composite aluminum substrate, including sequentially connecting a copper foil conductive layer 1, a first flexible thermally conductive adhesive layer 2, an insulating layer 3, a second flexible thermally conductive adhesive layer 4, and a flexible heat-dissipating aluminum foil 5, the insulating layer 3 and the first flexible A first silver bromide photosensitive layer 6 is arranged between the thermally conductive adhesive layers 2, a second silver bromide photosensitive layer 7 is arranged between the insulating layer 3 and the second flexible thermally conductive adhesive layer 4, and the first silver bromide photosensitive layer The total area of ​​6 and the second silver bromide photosensitive layer 7 is 2 / 3 of the insulating layer 3 .

[0029] The thickness of the first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 0.5 μm.

[0030] The insulating layer 3 is a polyimide film with a thickness of 20 μm.

[...

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Abstract

The invention provides a flexible composite aluminum substrate and a preparation method thereof. The flexible composite aluminum substrate comprises a copper foil conducting layer, a first flexible heat conducting glue layer, an insulation layer, a second flexible heat conducting glue layer and a flexible radiating aluminum foil which are connected successively, a first silver bromide photosensitive layer is arranged between the insulation layer and the first flexible heat conducting glue layer, a second silver bromide photosensitive layer is arranged between the insulation layer and the second flexible heat conducting glue layer, and the total area of the first and second silver bromide photosensitive layers is 1 / 5 to 2 / 3 that of the insulation layer. The preparation method is simple, the flexible composite aluminum substrate can be used for information storage innovatively, and the utilization rate of the products is improved.

Description

technical field [0001] The invention belongs to the field of raw materials for electronic products, and in particular relates to a flexible composite aluminum substrate and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of lightness, smallness, thinness, and flexibility, the demand for flexible circuit boards has suddenly emerged. In recent years, the LED market has grown by leaps and bounds, and traditional rigid aluminum substrates can no longer meet market demand. At present, the structure of the traditional aluminum substrate is aluminum plate + adhesive layer + copper foil. The utility model patent publication number: CN204157157U implements that one side of the aluminum foil is coated with an insulating and heat-conducting layer, the other side is coated with an anti-corrosion layer, and then a flexible insulating and heat-conducting layer is coated on the insulating and heat-conducting layer, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05H05K3/02B32B9/04B32B15/08B32B15/20
CPCB32B9/04B32B15/08B32B15/20B32B2255/20B32B2457/08H05K1/0204H05K1/056H05K3/022
Inventor 雷成张劭群
Owner DONGGUAN YILIAN ELECTRONICS TECH
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