Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape

A thermal peeling tape, sticking and pressing technology, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., to achieve the effect of improving thermal peeling performance, preventing breakage and increasing productivity

Inactive Publication Date: 2015-12-09
SHENZHEN MEIXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problems of the existing pressure-sensitive adhesive tape, the present inventi

Method used

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  • Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape
  • Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape

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Embodiment Construction

[0017] Below in conjunction with example the present invention is described in further detail.

[0018] A heat-losing pressure-sensitive adhesive proposed by the present invention is prepared from the following raw materials in percentage by weight: 20.0%-40.0% of polymer polymethacrylate, 69.5%-38.5% of organic solvent, and 0.50% of curing agent ~1.50%, thermal expansion additive 10.0%~20.0%. Wherein, the solid content of the heat-losing pressure-sensitive adhesive is 20%-40% by weight.

[0019] According to the needs, the heat-losing pressure-sensitive adhesive can be made with different proportions of components. For example, the following examples can be used:

[0020]

[0021] The polymer polymethacrylate is at least a mixture of two raw materials of polymethyl methacrylate, polyethyl methacrylate and polybutyl methacrylate. The organic solvent is at least a mixture of two raw materials in toluene, ethyl acetate and butanone. The curing agent is at least one of isoc...

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PUM

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Abstract

The invention discloses a thermal viscosity loss pressure-sensitive adhesive, which is prepared from the following ingredients in percentage by weight: 20.0 percent to 40.0 percent of macromolecular polymethacrylate, 69.5 percent to 38.5 percent of an organic solvent, 0.50 percent to 1.50 percent of a curing agent and 10.0 percent to 20.0 percent of a thermal expansion additive, wherein the weight percentage of solid content in the thermal viscosity loss pressure-sensitive adhesive is 20 percent to 40 percent. The invention also discloses a thermally peelable adhesive tape and a preparation method of the thermally peelable adhesive tape. When the thermally peelable adhesive tape is adhered onto an adhered object and is heated to foam so that micro spheres expand, the viscosity of a thermal viscosity loss pressure-sensitive adhesive layer is greatly reduced. When the thermally peelable adhesive tape is applied for temporary fixation in electronic devices, the damage of elements can be effectively prevented, and the product yield is improved.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive and an adhesive tape, in particular to a heat-losing pressure-sensitive adhesive, heat-peelable adhesive tape, and a preparation method thereof, which can be used for protection in the inductance and capacitor industries and metal cutting processes. Background technique [0002] With the rapid development of electronic manufacturing technology, protective films are required in many manufacturing processes. For example, when the metal frame is CNC processed, it is necessary to paste the protective film tape. However, in the process of processing, due to heat generated by heating or cutting friction, the adhesive of the protective film tape will remain on the object to be pasted, and the object to be pasted must be cleaned due to the residual glue. Or because the peeling force of the adhesive tape is increased, when the components are peeled off, the components will be picked up to cause damage to t...

Claims

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Application Information

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IPC IPC(8): C09J133/10C09J11/00C09J11/06C09J11/08C09J7/02
Inventor 曹凤秀陆兰硕林学好
Owner SHENZHEN MEIXIN ELECTRONICS
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