Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Technology for recycling palladium from acid palladium waste solution obtained after activation of colloid activating palladium

A technology for palladium activation and acid palladium, applied in the field of palladium recovery, can solve problems such as complicated operation steps, high production cost, low production efficiency, etc., and achieve the effects of avoiding complicated operations, reducing waste water discharge, and reducing acid gas discharge

Active Publication Date: 2015-12-09
中新联科环境科技(安徽)有限公司
View PDF2 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the number of times of heating and precipitation in this traditional method is too many, resulting in cumbersome operation steps, low production efficiency and high production cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention. The implementation conditions used in the examples can be further adjusted according to the manufacturer's conditions, and the unspecified implementation conditions are usually conventional experimental conditions.

[0059] A kind of process of reclaiming palladium from the acid palladium waste liquid after colloid activated palladium activation of the present invention comprises the following steps:

[0060] 1) Rough refining

[0061] Wherein palladium content 10~250mg / L in acid palladium waste liquid, add reductant zinc powder and palladium is replaced from described acid palladium waste liquid, the waste water after the replacement is pumped to centrifuge with pump to centrifuge, obtains metal palladium, tin , copper, zinc and nickel crude palladium;

[0062] 2) Dissolving crude palladium

[0063] The dissolution reaction formula...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a technology for recycling palladium from an acid palladium waste solution obtained after activation of colloid activating palladium. The technology comprises the following steps that firstly, coarse refining is carried out; secondly, coarse palladium is dissolved; thirdly, stannic acid is settled, filtered and recycled; fourthly, enrichment of anion resin is carried out; fifthly, strong basicity anion exchange is carried out to regenerate resin; sixthly, the pH value is regulated; seventhly, reduction is carried out. By means of the technology, stannic acid is recycled, cost is reduced, the waste water discharge volume and the acid gas discharge volume are reduced, the cumbersome operation of repeated settling and filtering in a traditional recycling method is avoided, the dosage of chemical agents is reduced, the removing rate of impure metal ions is high, and the purity of refined palladium is high.

Description

technical field [0001] The invention relates to a process for recovering palladium from acid palladium waste liquid after activation of colloidal activated palladium. Background technique [0002] One of the most critical processes in the manufacture of printed circuit boards (PCBs) is the hole metallization (PTH) process. The PCB base material is a non-metallic conductor, and the hole metallization needs to be cleaned, pre-dipped, activated, electroless copper plating and electroplating copper thickening. [0003] Among them, the activation process is a very important link in the hole metallization process. At present, the main activation solutions for PCB electroless copper plating are: ionic palladium and colloidal palladium. Because the pH control range of the ionic palladium activation solution is relatively narrow, it is rarely used. Colloidal palladium activation solution can generally be divided into acid-based colloidal palladium and salt-based colloidal palladium...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22B7/00C22B11/00
Inventor 曾迪吴文明
Owner 中新联科环境科技(安徽)有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More