EMI filter of folding chained form feedthru capacitor structure

A feedthrough capacitor and filter technology, applied in the field of EMI filters, can solve problems such as limited filtering capability of a single capacitor element, affecting circuit delay characteristics, large out-of-band attenuation, etc., to improve the performance of anti-instantaneous current breakdown, reduce Small size and weight, the effect of improving device yield

Active Publication Date: 2015-12-09
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For capacitive chip EMI filters commonly used in electronic systems, due to the limited filtering capability of a single capacitive element, it is difficult to achieve large out-of-band attenuation on the basis of ensuring passband performance, so the performance is limited; if you want to improve For out-of-band attenuation performance, it is necessary to increase the capacitance, but too much capacitance will affect the delay characteristics of the circuit

Method used

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  • EMI filter of folding chained form feedthru capacitor structure
  • EMI filter of folding chained form feedthru capacitor structure
  • EMI filter of folding chained form feedthru capacitor structure

Examples

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Effect test

Embodiment 1

[0037] In the EMI filter with folded chain-type feedthrough capacitor structure provided in Example 1, the laminated substrate 5 is made of a ceramic material with a dielectric constant of 3000. The exploded perspective view of the laminated substrate is shown in figure 2 As shown, there are a total of seven layers of substrates printed with electrodes; the electrodes include a grounding plate and a conductive plate;

[0038] From bottom to top, the fourth grounding plate 2d is printed on the first layer of ceramic base 1g, the third conductive plate 3c is printed on the second layer of ceramic base 1f, and the third grounding plate is printed on the third layer of ceramic base 1e 2c, the second conductive electrode plate 3b is printed on the fourth layer of ceramic substrate 1d, the second ground electrode plate 2b is printed on the fifth layer of ceramic substrate 1c, and the first conductive electrode plate 3a is printed on the sixth layer of ceramic substrate 1b. The seve...

Embodiment 2

[0045] The exploded perspective view of the laminated substrate of the EMI filter with the folded chain feedthrough capacitance structure provided by Embodiment 2 is as follows Figure 4 As shown, the laminated substrate 5 is formed by laminating and co-firing electrolyte ceramic materials with a dielectric constant of 1100, as shown in Figure 4 As shown, there are a total of 15 layers of substrates printed with electrodes; the electrodes include grounding plates and conductive plates;

[0046] From top to bottom, the first layer of substrate 1a is provided with a grounding plate 2a, the third layer of base 1c is provided with a grounding plate 2b, the fifth layer of plate 1e is provided with a grounding plate 2c, and the seventh layer of substrate 1g A grounding plate 2d is provided on the top, a grounding plate 2e is provided on the ninth layer substrate 1i, a grounding electrode plate 2f is provided on the eleventh layer substrate 1k, and a grounding electrode plate 2g is ...

Embodiment 3

[0062] The exploded perspective view of the laminated substrate of the EMI filter with the folded chain feedthrough capacitance structure provided by Embodiment 3 is as follows Figure 6 , the laminated substrate 5 is formed by laminating and co-firing 23 layers of electrolyte ceramic materials with a dielectric constant of 2000;

[0063] The first layer of substrate 1a is provided with a grounding plate 2a, the third layer is basically 1c with a grounding plate 2b, the fifth layer of plate 1e is provided with a grounding plate 2c, and the seventh layer of substrate 1g is provided with a grounding electrode plate 2d, the ninth layer substrate 1i is provided with a ground electrode plate 2e, the eleventh layer substrate 1k is provided with a ground electrode plate 2f, the thirteenth layer substrate 1m is provided with a ground electrode plate 2g, and the fifteenth layer substrate 1o A grounding plate 2h is provided on the top, a grounding plate 2i is provided on the seventeenth...

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Abstract

The invention discloses an EMI filter of a folding chained form feedthru capacitor structure. The EMI filter comprises a laminated substrate, an input terminal, an output terminal and two ground terminals; the laminated substrate comprises a substrate, conductive polar plates, a ground polar plate and a metal through hole, which are laminated from bottom to top in sequence; the conductive polar plate is arranged on the surface of the substrate; one end of the conductive polar plate at the first layer is connected with the input terminal, one end of the conductive polar plate on the last layer is connected with the output terminal, and the ground polar plate is arranged on the surface of the rest substrate; both ends of the ground polar plate are connected with the two ground terminals; the metal through hole is along the lamination direction of the substrate, and the conductive polar plates are connected at heads and tails through the metal through hole, so that the conductive polar plates and the ground polar plate from a spatial folding chained form feedthru capacitor structure. The chained form structure of the EMI filter provided by the invention folds and cascades a plurality of feedthru capacitors to make full use of the parasitic effect in the structure in a limited volume to achieve excellent out-of-band rejection.

Description

technical field [0001] The invention belongs to the technical field of EMI filters, and more specifically relates to an EMI filter with a folded chain feedthrough capacitor structure. Background technique [0002] Electronic equipment brings convenience to people's production and life, but it also introduces the problem of electromagnetic interference (EMI) to other electronic equipment caused by the external emission of electromagnetic noise from the equipment, and is extremely susceptible to electromagnetic interference from the external environment; in order to prevent the equipment from being affected by external In the event of malfunction or damage due to noise interference, it is necessary to take necessary protective measures. The noise frequency of most electronic equipment is higher than the frequency of the circuit signal. Low-pass filters are often used to filter high-frequency signals and retain low-frequency operating signals. This filter is often called an EMI...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H7/01
Inventor 王晓川楼熠辉孙洋洋吕文中
Owner HUAZHONG UNIV OF SCI & TECH
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