Production method of sapphire fingerprint identification panel
A fingerprint recognition and production method technology, applied in character and pattern recognition, input/output process of data processing, instruments, etc., can solve the problems of poor quality and low yield of fingerprint recognition panels, and achieve complete wafer structure and small deformation. , the effect of improving efficiency
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Embodiment 1
[0031] The sapphire fingerprint identification panel production method of the present embodiment specifically comprises the following steps:
[0032] Step 1, crystal ingot; take the C-oriented sapphire crystal, and then use the ingot machine to extract the ingot, so as to obtain the crystal ingot;
[0033] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0034] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0035] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.022Mpa, and the speed of the grinding disc is 1200rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include: 2% cubic boron nitride powder with a particle size of...
Embodiment 2
[0043] The sapphire fingerprint identification panel production method of the present embodiment specifically comprises the following steps:
[0044] Step 1. Crystal ingot; take the C-oriented sapphire crystal, and then use the rod-extracting machine to extract the rod, so as to obtain the C-oriented crystal ingot;
[0045] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0046] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0047] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.02Mpa, and the speed of the grinding disc is 1000rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include: 0.5% cubic boron nitride powder with...
Embodiment 3
[0055] The sapphire fingerprint identification panel production method of the present embodiment specifically comprises the following steps:
[0056] Step 1. Crystal ingot; take the C-oriented sapphire crystal, and then use the rod-extracting machine to extract the rod, so as to obtain the C-oriented crystal ingot;
[0057] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0058] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0059] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.02Mpa, and the speed of the grinding disc is 1100rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include: 1% cubic boron nitride powder with a...
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