Polymer composite high in heat-conducting property

A composite material and polymer technology, which is applied in the field of polymer composite material preparation, can solve the problems of high filling fraction of thermally conductive fillers, decreased toughness of composite materials, and loss of practical value, etc., to achieve excellent thermal conductivity, improved thermal conductivity, and excellent flame retardancy effect of effect

Inactive Publication Date: 2015-12-30
陈民
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, in order to obtain higher thermal conductivity, the filling fraction of thermally conductive fillers is often higher, which will lead to a significant decrease in the toughness of the composite material and lose its practical value.
On the other hand, as plastic products are more and more widely used in life, flammability has become the biggest drawback of plastic products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The raw material components are selected in terms of weight fractions: 30 parts of resin matrix, 65 parts of thermally conductive filler, 4 parts of toughening filler, 0.8 part of antioxidant, and 1 part of dispersant.

[0029] The resin matrix is ​​a combination of a polyurethane resin matrix, a polyethersulfone resin matrix and an acrylonitrile-butadiene-styrene copolymer (ABS) resin matrix at a weight ratio of 1:2:3. The thermally conductive filler includes inorganic particle thermally conductive filler and carbon-based thermally conductive filler, and the weight ratio of the inorganic particle thermally conductive filler to carbon-based thermally conductive filler is 7:1. Inorganic particle thermal conductive filler is a mixture of spherical alumina, crystalline silica and scaly high thermal conductive carbon powder in a weight ratio of 1:1:2, and the carbon-based thermal conductive filler is multi-walled carbon nanotubes, polypropylene nitrile-based carbon The fibe...

Embodiment 2

[0035] The raw material components are selected in terms of weight fractions: 40 parts of resin matrix, 80 parts of thermally conductive filler, 14 parts of toughening filler, 1.8 parts of antioxidant, and 4 parts of dispersant.

[0036] The resin matrix is ​​a combination of a polyurethane resin matrix, a polyethersulfone resin matrix and an acrylonitrile-butadiene-styrene copolymer (ABS) resin matrix at a weight ratio of 1:2:3. The thermally conductive filler includes inorganic particle thermally conductive filler and carbon-based thermally conductive filler, and the weight ratio of the inorganic particle thermally conductive filler to carbon-based thermally conductive filler is 7:1. Inorganic particle thermal conductive filler is a mixture of spherical alumina, crystalline silica and scaly high thermal conductive carbon powder in a weight ratio of 1:1:2. Carbon-based thermal conductive fillers are multi-walled carbon nanotubes and polypropylene nitrile-based carbon The fibe...

Embodiment 3

[0039] The raw material components are selected in terms of weight fractions: 35 parts of resin matrix, 75 parts of thermally conductive filler, 10 parts of toughening filler, 1.6 parts of antioxidant, and 2 parts of dispersant.

[0040] The resin matrix is ​​a combination of a polyurethane resin matrix, a polyethersulfone resin matrix and an acrylonitrile-butadiene-styrene copolymer (ABS) resin matrix at a weight ratio of 1:2:3. The thermally conductive filler includes inorganic particle thermally conductive filler and carbon-based thermally conductive filler, and the weight ratio of the inorganic particle thermally conductive filler to carbon-based thermally conductive filler is 7:1. Inorganic particle thermal conductive filler is a mixture of spherical alumina, crystalline silica and scaly high thermal conductive carbon powder in a weight ratio of 1:1:2, and the carbon-based thermal conductive filler is multi-walled carbon nanotubes, polypropylene nitrile-based carbon The f...

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Abstract

The invention relates to a polymer composite high in heat-conducting property. The polymer composite is characterized by being prepared from, by weight, 30-40 parts of resin matrix, 65-80 parts of heat conduction filling materials, 4-14 parts of toughening filling materials, 0.8-1.8 parts of antioxidants and 1-4 parts of dispersing agents. Raw materials obtained after pretreatment are subjected to fusion and mixing through high polymer material processing equipment, and prilling is completed. The maximum heat conductivity coefficients of final products are all larger than 5.2 W / m.K, the flame retardant property and insulating property are excellent, and the mechanical property is good. The obtained polymer composite is wide in raw material source, low in cost and simple and practicable in preparation approach, excellent in heat-conducting property, insulating property, flame retardant property and mechanical property and is capable of being widely applied to the fields such as meter cases, automobiles, chemical engineering energy, aviation and aerospace.

Description

technical field [0001] The invention belongs to the field of polymer composite material preparation, and in particular relates to a high thermal conductivity polymer composite material. Background technique [0002] Polymer-based composites have been widely used due to their light weight, easy processing, wear resistance, simple preparation, and easy industrialization. However, the thermal conductivity of most polymer materials is extremely low. If a certain thermal conductivity is endowed to polymer materials, the application fields of polymer materials can be greatly expanded. If the insulation performance of the polymer composite material is guaranteed on the basis of a certain thermal conductivity, it will have great positive significance for improving the accuracy and life of electrical and microelectronic devices and solving the needs of a large number of insulation and heat dissipation applications in reality. [0003] Generally speaking, in order to obtain higher th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L55/02C08L75/04C08L81/06C08L25/10C08L23/08C08L23/28C08K13/06C08K9/04C08K9/00C08K7/18C08K3/36C08K3/04C08K7/24C08K7/06
Inventor 陈民殷姝媛宗铭郭敏
Owner 陈民
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