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Hydrazine reducing agent cyanide-free cuprous electroplating solution and electroplating method

A technology of electroplating solution and reducing agent, which is applied in the field of electroplating copper technology, can solve the problems of unsatisfactory performance of the plating solution and poor quality of the coating, and achieve the effect of excellent performance of the plating solution, good quality of the coating and low porosity

Inactive Publication Date: 2015-12-30
WUXI HANKWANG ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing cyanide-free copper plating generally has the technical defects that the performance of the plating solution is not ideal and the quality of the coating is not strong, which seriously restricts the complete replacement of cyanide-free copper plating in the industry.

Method used

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  • Hydrazine reducing agent cyanide-free cuprous electroplating solution and electroplating method
  • Hydrazine reducing agent cyanide-free cuprous electroplating solution and electroplating method
  • Hydrazine reducing agent cyanide-free cuprous electroplating solution and electroplating method

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Experimental program
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Effect test

Embodiment 1

[0036] The formulation of the electroplating solution is as follows:

[0037]

[0038]

[0039] Plating process conditions: the pulse width of single pulse square wave current is 0.4ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 55°C, and the electroplating time is 40min.

Embodiment 2

[0041] The formulation of the electroplating solution is as follows:

[0042]

[0043] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 25%, and the average current density is 0.7A / dm 2 ; The pH is 8.5, the temperature is 50°C, and the electroplating time is 30min.

Embodiment 3

[0045] The formulation of the electroplating solution is as follows:

[0046]

[0047] Plating process conditions: the pulse width of single pulse square wave current is 0.7ms, the duty cycle is 20%, and the average current density is 0.9A / dm 2 ; The pH is 9, the temperature is 45° C., and the electroplating time is 20 minutes.

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Abstract

The invention discloses a hydrazine reducing agent cyanide-free cuprous electroplating solution and an electroplating method. The electroplating solution comprises 10-25g / L of Cu2O, 59-99g / L of succinimide, 20-40g / L of a hydrazine compound, 0.15-0.5g / L of tetramethyldipropylenetriamine and 10-20g / L of phosphate. The electroplating solution utilizes Cu2O as a copper source, a hydrazine compound as a cuprous stabilizing agent, succinimide as a cuprous ion coordination agent, tetramethyldipropylenetriamine as a brightener and phosphate as a conductive salt so that the electroplating solution has a good dispersion force, a deep plating capability, high cathode current efficiency and excellent plating solution performances. Through the electroplating solution, the plated layer obtained by electroplating under alkaline conditions has low porosity and has good quality.

Description

technical field [0001] The invention relates to the technical field of copper electroplating technology, in particular to an electroplating solution and an electroplating method for cyanide-free monovalent copper plating with a hydrazine reducing agent. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid and heated concentrated sulfuric acid, and acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 王军
Owner WUXI HANKWANG ELECTRIC
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