Hydrazine reducing agent cyanide-free cuprous electroplating solution and electroplating method

A technology of electroplating solution and reducing agent, which is applied in the field of electroplating copper technology, can solve the problems of unsatisfactory performance of the plating solution and poor quality of the coating, and achieve the effect of excellent performance of the plating solution, good quality of the coating and low porosity
CN105200464AInactive Publication Date: 2015-12-30WUXI HANKWANG ELECTRIC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUXI HANKWANG ELECTRIC
Publication Date
2015-12-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a hydrazine reducing agent cyanide-free cuprous electroplating solution and an electroplating method. The electroplating solution comprises 10-25g / L of Cu2O, 59-99g / L of succinimide, 20-40g / L of a hydrazine compound, 0.15-0.5g / L of tetramethyldipropylenetriamine and 10-20g / L of phosphate. The electroplating solution utilizes Cu2O as a copper source, a hydrazine compound as a cuprous stabilizing agent, succinimide as a cuprous ion coordination agent, tetramethyldipropylenetriamine as a brightener and phosphate as a conductive salt so that the electroplating solution has a good dispersion force, a deep plating capability, high cathode current efficiency and excellent plating solution performances. Through the electroplating solution, the plated layer obtained by electroplating under alkaline conditions has low porosity and has good quality.
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Description

technical field

[0001] The invention relates to the technical field of copper electroplating technology, in particular to an electroplating solution and an electroplating method for cyanide-free monovalent copper plating with a hydrazine reducing agent. Background technique

[0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid and heated concentrated sulfuric acid, and acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film.

[0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright...

Claims

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