Thermosetting epoxy resin composition and applications thereof

A technology of epoxy resin and novolac epoxy resin, which is applied in the electronic field, can solve the problems of low water absorption and insufficient heat resistance, and achieve good heat resistance

Active Publication Date: 2016-01-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The present invention uses aromatic amine and dicyandiamide curing agent to compound and cure epoxy resin, and then cooperates with inorganic fillers containing boehmite or barium sulfate. The copper clad laminate made with it has a CTI greater than 600V and a flame retardancy of V-0 level. Low water absorption, and has good heat resistance, cohesiveness and processing reliability, overcomes the problems of insufficient heat resistance and high water absorption in the past when using aluminum hydroxide fillers and dicyandiamide alone for curing, and can be suitable for High temperature lead-free soldering requirements

Method used

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  • Thermosetting epoxy resin composition and applications thereof
  • Thermosetting epoxy resin composition and applications thereof
  • Thermosetting epoxy resin composition and applications thereof

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Embodiment Construction

[0051] The technical solutions of the present invention will be further described below through specific embodiments.

[0052] The thermosetting epoxy resin composition of the present invention is used to make copper-clad laminates, and the properties such as glass transition temperature, CTI, flame retardancy, resistance to dipping soldering time and drilling processing are tested, as further illustrated and described in the following examples and comparative examples .

[0053] The specific components of the thermosetting epoxy resin composition are as follows:

[0054] (A) epoxy resin:

[0055] A1: brominated bisphenol A type epoxy resin (DER530A80, ​​epoxy equivalent is 430g / eq, produced by American DOW Chemical Company);

[0056] A2: phosphorus-containing epoxy resin (YEP-250, the epoxy equivalent is 325g / eq, produced by Guangshan Chemical Company);

[0057] A3: Bisphenol A type Novrak epoxy resin (EPR627, epoxy equivalent weight 210g / eq, produced by American Momentive...

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Abstract

The invention discloses a thermosetting epoxy resin composition and applications thereof. The thermosetting epoxy resin composition comprises, by weight, 100 parts of epoxy resin, 1 to 10 parts of aromatic diamine, 0.5 to 2.2 parts of dicyanodiamide, 30 to 200 parts of an inorganic filling material containing boehmite or/and barium sulfate, and 0.05 to 1.0 part of a curing accelerator. CTI of the thermosetting epoxy resin composition is larger than 600 V; the thermosetting epoxy resin composition is low in water absorption, and excellent in cohesiveness and machine processing characteristic; is capable of improving adaptive capacity of PCB in severe environment obviously, and can be used for producing prepregs and laminated boards used for preparing printed circuits.

Description

technical field [0001] The invention relates to a thermosetting epoxy resin composition and its application, in particular to a thermosetting epoxy resin composition and a prepreg for a printed circuit board and a laminate made of the thermosetting epoxy resin composition, which are mainly used in the electronic field. Background technique [0002] Printed circuit board (PCB) is used as the basic material of electronic products and is widely used in daily electrical products. In recent years, with the multi-functional and high-performance development of household electronic products, its PCB lines are becoming more and more dense, and its use voltage is relatively high, so higher requirements are placed on the insulation reliability between lines, especially When electrical products are used in harsh environments such as high temperature, humidity, and pollution, at this time, the surface of the insulating substrate of the circuit board is easy to accumulate dust, water, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/50C08K3/22C08K3/30C08J5/24B32B15/092B32B27/04H05K1/03
CPCC08G59/20C08G59/60C08J5/24C08K3/10C08K3/22C08K5/0066C08K5/17C08K5/3445C08K5/5313C08L63/00C08L2201/02
Inventor 方克洪李辉徐莹
Owner GUANGDONG SHENGYI SCI TECH
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