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Manufacture method for target substrate

A manufacturing method and substrate technology, which are applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of troublesome welding bonding process, easy oxidation of target material, and high process cost, so as to improve the bonding stability, The effect of avoiding target oxidation and low equipment cost

Inactive Publication Date: 2016-01-13
SOLAR APPL
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Problems solved by technology

[0003] In the prior art, the target and the back plate are mainly bonded by welding, but since the target is easily oxidized during the welding process, the purity of the target material will be affected.
To avoid oxidation problems, for example, soldering can be performed in a vacuum environment, but an additional vacuum device for soldering is required, which will result in high overall process costs
Moreover, the soldering and bonding process is cumbersome and inconvenient to carry out. Therefore, the known method of bonding the target and the backplane needs to be improved.

Method used

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  • Manufacture method for target substrate
  • Manufacture method for target substrate
  • Manufacture method for target substrate

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no. 1 example

[0017] refer to figure 1 and figure 2 , the first embodiment of the target substrate manufacturing method of the present invention, comprising:

[0018] Step 11: Provide a substrate 2, such as a metal substrate with certain mechanical strength and good heat conduction effect, or a ceramic substrate with certain mechanical strength and uniform heat conduction and heat dissipation effect. Specifically, the substrate 2 can be a copper substrate. Furthermore, an adhesive layer 3 may be coated on the surface of the substrate 2, such as OCA optical adhesive.

[0019] Step 12: setting a target 4 on the substrate 2 , the target 4 has a back surface 41 facing the substrate 2 and a sputtering surface 42 opposite to the back surface 41 . Specifically, the target material 4 of this embodiment is located on the adhesive layer 3 , and further arranged on the substrate 2 through the adhesive layer 3 . The target 4 is a target 4 required for magnetron sputtering, such as an oxide target,...

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Abstract

A manufacture method for a target substrate, comprising: (A) providing a substrate; (B)arranging a target on the substrate; (C) putting the substrate and the target in a bag body, vacuumizing and heating the bag body, so that the substrate and the target are bonded and fixed together. By the step of vaccumizing, the substrate and the target are tightly combined, stability of combination is increased, and oxidation of the target in the vacuum environment is prevented. By the step of heating, the substrate and the target are tightly bonded. Compared to traditional welding method, the manufacture method by the invention has low equipment cost, simple steps, and easy operation.

Description

technical field [0001] The invention relates to a method for manufacturing a target substrate, in particular to a method for manufacturing a target substrate for combining a target of sputtering equipment and a substrate on the back of the target. Background technique [0002] The magnetron sputtering coating method mainly uses ions of a bombardment gas (such as argon) to strike a target, so that the target material is sputtered and deposited on a substrate to be coated, and then a thin film is formed on the substrate. In fact, when the target is used, a metal back plate will be combined on the back of the target to form an assembly of the target and the back plate. Through the metal back plate, on the one hand, the target can be provided with sufficient mechanical strength as a support, and on the other hand, the back plate can be connected to a cooling water circulation system to take away the target material generated during the sputtering process through the back plate. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 陈庆丰陈敬尧
Owner SOLAR APPL
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