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Electroplating method for improving deep plating capacity of circuit board with high aspect ratio

A circuit board and aperture ratio technology, applied in jewelry and other fields, can solve the problems of inability to achieve a good deep plating effect and large consumption of electroplated copper balls, and achieve the effect of improving the quality of electroplating and saving the cost of plating solution

Inactive Publication Date: 2016-01-20
四川普瑞森电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing electroplating processes are controlled in terms of plating solution, current density and plating time, but they still cannot achieve a good deep plating effect, especially when plating circuit boards with high thickness-to-diameter ratio, the depth capability Only between 60% and 70%, and the consumption of electroplated copper balls is relatively large

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The electroplating method for improving the deep plating ability of a circuit board with a high plate thickness and aperture ratio comprises the following steps:

[0018] S1. Prepare the plating solution: wash the inner wall of the cylinder, remove the sundries, and control the content of each component contained in each liter of the plating solution in the plating tank: sulfuric acid: 240g, copper sulfate: 68g, and the balance is Deionized water, and control the temperature in the plating tank to 20°C;

[0019] S2. Board loading: clamp the circuit board to be plated on the material plate clamp, and put it into the plating tank;

[0020] S3. Plating: control the current density at 10ASF, control the unilateral swing range of the material plate clamp to 5.5cm, and the swing frequency is 12 times / min, and the plating time is 36min;

[0021] S4, unloading: remove the plated circuit board from the material board holder, and dry it.

[0022] In the step S1, a copper polish...

Embodiment 2

[0025] The electroplating method for improving the deep plating ability of a circuit board with a high plate thickness and aperture ratio comprises the following steps:

[0026] S1, preparation of plating solution: wash the inner wall of the cylinder, remove the sundries, and control the content of each component contained in each liter of plating solution in the plating tank: sulfuric acid: 220g, copper sulfate: 65g, and the balance is Deionized water, and control the temperature in the plating tank to 22°C;

[0027] S2. Board loading: clamp the circuit board to be plated on the material plate clamp, and put it into the plating tank;

[0028] S3. Plating: control the current density to 12ASF, control the unilateral swing range of the material plate clamp to 4cm, and the swing frequency is 10 times / min, and the plating time is 34min;

[0029] S4, unloading: remove the plated circuit board from the material board holder, and dry it.

[0030] In the step S1, a copper polishing...

Embodiment 3

[0034] The electroplating method for improving the deep plating ability of a circuit board with a high plate thickness and aperture ratio comprises the following steps:

[0035] S1, preparation of plating solution: wash the inner wall of the cylinder, remove the sundries, and control the content of each component contained in each liter of plating solution in the plating tank: sulfuric acid: 210g, copper sulfate: 66g, and the balance is Deionized water, and control the temperature in the plating tank to 23°C;

[0036] S2. Board loading: clamp the circuit board to be plated on the material plate clamp, and put it into the plating tank;

[0037] S3. Plating: control the current density to 13ASF, control the unilateral swing range of the material plate clamp to 4.3cm, and the swing frequency is 11 times / min, and the electroplating time is 33min;

[0038] S4, unloading: remove the plated circuit board from the material board holder, and dry it.

[0039] In the step S1, a copper ...

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PUM

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Abstract

The invention relates to an electroplating method for improving deep plating capacity of a circuit board with a high aspect ratio. The electroplating method comprises the following steps: S1, preparing a plating solution: flushing the inner wall of a cylinder body to clear impurities, controlling each liter of the plating solution in a plating bath to comprise the following components: 200-240g of sulfuric acid, 60-68g of copper sulfate and the balance of deionized water, and controlling the temperature in the plating bath to be 20-25 DEG C; S2, loading: clamping a to-be-plated circuit board on a material plate clamp, and putting the to-be-plated circuit board into the plating bath; S3, plating: controlling current density to be 10-15 ASF, controlling a single-side swing amplitude of the material plate clamp to be 3.5-5.5cm, controlling swing frequency to be 9-12 times / min, and controlling electroplating time to be 32-36 minutes; and S4, picking: getting down the plated circuit board from the material plate clamp and drying. The electroplating method has the advantages that: the board with the high aspect ratio is good in deep electroplating capacity, and market competitiveness is improved; and utilization of copper balls and thin balls is reduced, and electroplating cost is reduced.

Description

technical field [0001] The invention relates to a copper plating process for circuit board holes with high board thickness and aperture ratio, in particular to an electroplating method for improving deep plating ability of a circuit board with high board thickness and aperture ratio. Background technique [0002] Polyimide, polyester and other substrates used in circuit boards are polymer materials with good insulation properties. To make the surface a conductor, electroless plating is one of the widely used technologies. Conductorized (metallized) holes are channels for connecting lines between different layers, and high-quality hole metallization quality is the basic guarantee for the electrical performance of the product. After years of research and development, the electroplating technology has been quite mature (whether it is electroplating copper, electroplating nickel, or electroplating metal alloys), and the basic factors that affect the quality of electroplating hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00
Inventor 刘庆辉
Owner 四川普瑞森电子有限公司
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