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Heat-storage composition

A composition and heat storage technology, applied in the direction of heat exchange materials, electrical components, circuits, etc., can solve problems such as easy damage, and achieve uniform heat release, high heat storage effect, heat storage and high thermal conductivity.

Active Publication Date: 2016-01-20
FUJI POLYMER INDUSTRIES CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, microcapsules also have the problem of being easily broken when mixed with matrix resin materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] 1. Material composition

[0095] (1) Silicone ingredients

[0096] As the silicone component, a two-component room temperature curing silicone rubber was used. In addition, a base polymer component (component A), a crosslinking component (component B), and a platinum-based metal catalyst (component C) are added in advance to the two-liquid RTV. The above-mentioned two-component RTV is a two-component type room temperature vulcanization (Room Temperature Vulcanizing).

[0097] (2) Thermal storage inorganic particles

[0098] Vanadium dioxide particles (VO2) with an average particle diameter of 20 μm were added in a ratio of 400 parts by weight (46 volume %) per 100 parts by weight of the silicone component. 2 ) and mix evenly. Vanadium dioxide particles (VO 2 ) The latent heat generated by the electronic phase transition is 245J / cc.

[0099] 2. Sheet forming processing method

[0100] A metal frame with a thickness of 3 mm was placed on the polyester film subjecte...

Embodiment 2

[0103] 1. Material composition

[0104] (1) Silicone ingredients

[0105] As the silicone component, a two-component room temperature curing silicone rubber was used. In addition, a base polymer component (component A), a crosslinking component (component B), and a platinum-based metal catalyst (component C) are added in advance to the two-liquid RTV.

[0106] (2) Thermal storage inorganic particles

[0107] Vanadium dioxide particles (VO 2 ) and mix evenly.

[0108] (3) Thermally conductive particles

[0109] (a) Small-diameter thermally conductive particles

[0110] The small-diameter thermally conductive particles were used by surface-treating alumina with an average particle diameter of 1 μm with a silane coupling agent. The added amount was set to 100 parts by weight with respect to 100 parts by weight of the silicone component.

[0111] (b) Medium-sized thermally conductive particles

[0112] The medium-diameter heat conductive particles were used by surface-trea...

Embodiment 3、 comparative example 2～3

[0135] Each composition is shown in Table 2. The surface treatment of the thermally conductive particles in Example 3 was the same as in Example 2, and the addition amount was 200 parts by weight of small-diameter thermally conductive particles, 425 parts by weight of medium-sized thermally conductive particles, and large 1000 parts by weight of heat conductive particles with a particle diameter, 1625 parts by weight in total. Except for this, it experimented similarly to Example 2.

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Abstract

A heat-storage composition (20) according to the present invention comprises a matrix resin (21) and heat-storage inorganic particles (22), wherein each of the heat-storage inorganic particles (22) comprises a substance that can undergo electronic phase transition and can generate latent heat of 1 J / cc or more upon the occurrence of electronic phase transition, and the heat-storage inorganic particles (22) are contained in an amount of 10 to 2000 parts by weight relative to 100 parts by weight of the matrix resin. The heat-storage composition (20) has a heat conductivity of 0.3 W / mK or more. The heat-storage composition may additionally comprise heat-conductive particles (23, 24). The heat-storage inorganic particles are preferably metal oxide particles each containing vanadium as the main metal component. The composition has a high heat storage property and high heat conductivity. The heat-storage silicone material is intercalated between a heat-generating part and a housing for use. Heat coming from the heat-generating part is stored once in the heat-storage composition to delay the conductivity of the heat. During this time, the heat is diffused and therefore partial heating can be avoided. In this manner, uniform heat dissipation can be achieved.

Description

technical field [0001] The present invention relates to a thermal storage composition. In more detail, it is related with the heat storage composition which has heat storage and heat conductivity. Background technique [0002] Semiconductors used in electronic equipment and the like generate heat during use, and the performance of electronic parts may degrade. Therefore, in electronic components that generate heat, a metal heat radiator is usually attached via a gel-like or soft rubber-like heat-conductive sheet. However, in recent years, a method of attaching a heat storage material sheet to heat-generating electronic components, storing heat in the heat storage material sheet, and slowing down the speed of heat transfer has also been proposed. [0003] In Patent Documents 1 and 2, heat storage rubber kneaded with microcapsules incorporating a heat storage material is proposed. Patent Document 3 proposes a heat countermeasure component in which the entire periphery of a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/02C08K3/00C08L101/00
CPCC08L101/00C09K5/00H01L23/427H01L23/4275H01L23/3737C09K5/063C08K3/22C08K9/04C08K9/06C08L83/00C08K2003/221C08K2201/005C08K2003/2227C08K2003/222C08K3/18C08K2003/2296C08K3/28C08K3/01C08K3/00C08K2201/001C08L83/04
Inventor 松村知树服部真和新高诚司河野公俊
Owner FUJI POLYMER INDUSTRIES CO LTD
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