Preparation method of Cu-Ni-Sn plate strip

A cu-ni-sn, copper alloy plate technology, applied in the field of copper alloys, can solve the problem that the tensile strength, yield strength and hardness of copper alloys cannot meet the requirements of production standards, so as to improve the melting and casting process, increase the strength, and improve the melting and casting quality effect

Active Publication Date: 2016-02-10
山西春雷铜材有限责任公司
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Problems solved by technology

[0004] In order to solve the technical problem that the final tensile strength, yield strength and hardness of copper alloys for lead frames

Method used

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  • Preparation method of Cu-Ni-Sn plate strip
  • Preparation method of Cu-Ni-Sn plate strip

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Embodiment Construction

[0021] The preparation method of TKA copper alloy strip, comprises the steps:

[0022] (1) According to the effective volume of the power frequency cored induction furnace, the mass ratio is copper: tin: nickel: phosphorus: zinc = 97.43: 1.5: 0.8: 0.07: 0.2 for batching; copper, tin, nickel, phosphor copper Put the intermediate alloy and zinc into the furnace body of the power frequency cored induction furnace and heat it to 1170-1210°C (1170°C, 1190°C, 1210°C) for melting, and then cover the surface of the melt with a layer of calcined charcoal with a thickness of 150-200mm , keep warm for 30 minutes, and then fully stir to obtain smelting water (smelting water is also called copper water);

[0023] (2) Use a crystallizer with a graphite inner sleeve to carry out the above-mentioned copper water at a temperature of 1170°C-1210°C (1170°C, 1190°C, 1210°C), and a casting speed of 2.4-3.0 m / h (2.4 m / h, 2.7 m / h, 3.0 m / h) semi-continuous casting process to obtain a rectangular ing...

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Abstract

The invention relates to the field of copper alloys, particularly relates to a preparation method of a Cu-Ni-Sn plate strip, solves the technical problem that the final tensile strength, yield strength and hardness of the copper alloy of lead frames in the prior art cannot meet the production standard requirements, and adopts the theories of solution strengthening, precipitation strengthening and work hardening. Hot rolling solution treatment is characterized in that the solubility of solute atoms is high at the high temperature, the solute atoms exist in base copper in form of solid solution, the solute elements are not precipitated in time after quickly cooling and form saturated solid solution; during the precipitation strengthening process, the solubility of Ni and Sn atoms in the copper are rapidly reduced and are precipitated from a substrate, and the substrate is diluted; during cold rolling process, the copper alloy plate strip generates plastic deformation, grains slip and entwist in a dislocation manner, so that the grains are elongated, crushed and fibered. Through the preparation method of the Cu-Ni-Sn plate strip, the requirements of high strength, high yield and high hardness can be achieved, so that the final tensile strength, yield strength and hardness of the TKA copper alloy plate strip are improved.

Description

technical field [0001] The invention relates to the field of copper alloys, in particular to a method for preparing Cu-Ni-Sn copper alloy strips. Background technique [0002] With the rapid development of science and technology, the requirements for the tensile strength, yield strength and hardness of the copper alloy materials used in the lead frames of electronic chips are getting higher and higher. The tensile strength of the ideal copper alloys for lead frames is currently desired Rm is 530-640MPa, yield strength Rp0.2≥520MPa, elongation after fracture A11.3≥6%, Vickers hardness HV is 160-195 (Vickers hardness value, no unit), and HV≥140 after softening. [0003] At present, the main materials used for lead frames in China are Cu-Fe-P alloys (C19400, C19210) and Cu-Ni-Si alloys (C70250). The existing problems of copper alloys for lead frames are: 1. The tensile strength of the existing Cu-Fe-P alloys (C19400, C19210) is 420-500 MPa, which cannot meet the technical requ...

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Application Information

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IPC IPC(8): C22C9/02C22C1/03C22F1/08
Inventor 李辉张晓敏王全仁张淑琴李大伟张美霞卫志强宁笃功卫煜堂陈婷
Owner 山西春雷铜材有限责任公司
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